de Vries, Tjibbe
38  Ergebnisse:
Personensuche X
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1

Efficient heat sink by ultrathin BCB bonding for InP membra..:

Zozulia, Aleksandr ; de Vries, Tjibbe ; Wang, Yi...
Japanese Journal of Applied Physics.  63 (2024)  4 - p. 04SP78 , 2024
 
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3

Wafer-scale adhesive bonding with hard Benzocyclobutene anc..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
 
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5

High-speed RF interconnects beyond 67 GHz in InP photonic i..:

, In: 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC),
 
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7

RF Interconnects for High-Speed and Dense Photonic Integrat..:

, In: 2019 21st International Conference on Transparent Optical Networks (ICTON),
 
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8

Wet Etched Silicon Interposer for the 2.5D Stacking of CMOS..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Li, Chenhui ; Smalbrugge, Barry ; de Vries, Tjibbe.. - p. 504-509 , 2016
 
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9

Vertical and Smooth Single-Step Reactive Ion Etching Proces..:

Jiao, Yuqing ; de Vries, Tjibbe ; Unger, Ralph-Stephan...
Journal of The Electrochemical Society.  162 (2015)  8 - p. E90-E95 , 2015
 
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11

An introduction to InP-based generic integration technology:

Smit, Meint ; Leijtens, Xaveer ; Ambrosius, Huub...
Semiconductor Science and Technology.  29 (2014)  8 - p. 083001 , 2014
 
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