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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Improving Warpage Characterization of Large Wafers in Fan-O..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Analysis of the Impact of Environmental Conditions on the R..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
4
Warpage of Fan-Out Panel Level Packaging – Experimental and..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
5
Modification of Prony Series Coefficients to Account for Th..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
6
Finite Element Influence Analysis of Power Module Design Op..:
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
7
Numerical simulation of transient thermomechanical ageing e..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
9
A Novel Packaging and System-Integration Platform with Inte..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
10
Process Simulation of Fan-Out Wafer Level Packaging: Influe..:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
11
Simulation challenges of warpage for wafer- and panel level..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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An approach for failure prediction in H3 TRB-tests:
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ,
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Combination of Experimental and Simulation Methods for Anal..:
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