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van Zeijl, Henk
49  Ergebnisse:
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1

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Du, Leiming ; van Zeijl, Henk... - p. 1891-1895 , 2024
Link: https://doi.org/10.1109/..
 
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2

Design, Fabrication, and Characterization of a 4H-SiC CMOS ..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Sattari, Romina ; van Zeijl, Henk ; Zhang, Guoqi - p. 1-3 , 2023
Link: https://doi.org/10.23919..
 
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3

Design and Manufacturing of an In-Package Relative Humidity..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sattari, Romina ; van Zeijl, Henk ; Zhang, Guoqi - p. 588-591 , 2023
Link: https://doi.org/10.1109/..
 
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4

Manipulation, Sampling and Inactivation of the SARS-CoV-2 V..:

Mantri, Devashish ; Wymenga, Luutzen ; van Turnhout, Jan..
Micromachines.  14 (2023)  2 - p. 345 , 2023
Link: https://doi.org/10.3390/..
 
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5

Microstructural and micromechanical characterization of sin..:

Ji, Xinrui ; Du, Leiming ; He, Shan..
Microelectronics Reliability.  150 (2023)  - p. 115180 , 2023
Link: https://doi.org/10.1016/..
 
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6

Manufacturing of an In-Package Relative Humidity Sensor for..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Sattari, Romina ; Zeijl, Henk van ; Zhang, Guoqi - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

Transient thermal measurement on nano-metallic sintered die..:

Sattari, Romina ; Hu, Dong ; Liu, Xu...
Applied Thermal Engineering.  221 (2023)  - p. 119503 , 2023
Link: https://doi.org/10.1016/..
 
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8

A Thin-film Reconfigurable SiC Thermal Test Chip for Reliab..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sattari, Romina ; Van Zeijl, Henk ; Zhang, Guoqi - p. 1309-1313 , 2023
Link: https://doi.org/10.1109/..
 
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9

Low Temperature Fine Pitch All-Copper Interconnects Combini..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Van Zeijl, Henk ; Jiao, Weiping... - p. 1237-1243 , 2023
Link: https://doi.org/10.1109/..
 
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10

Low Temperature Sapphire to Silicon Flip Chip Interconnects..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Ji, Xinrui ; Van Zeijl, Henk ; Romijn, Joost... - p. 368-372 , 2022
Link: https://doi.org/10.1109/..
 
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11

Patterning of fine-features in nanoporous films synthesized..:

, In: 2022 IEEE 22nd International Conference on Nanotechnology (NANO),
Ji, Xinrui ; van Ginkel, Hendrik Joost ; Hu, Dong... - p. 238-241 , 2022
Link: https://doi.org/10.1109/..
 
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12

In-air sintering of copper nanoparticle paste with pressure..:

Zhang, Boyao ; Damian, Andrei ; Zijl, Jurrian...
Journal of Materials Science: Materials in Electronics.  32 (2021)  4 - p. 4544-4555 , 2021
Link: https://doi.org/10.1007/..
 
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13

Monolithic integration of a smart temperature sensor on a m..:

da Ponte, Ronaldo Martins ; Gaio, Nikolas ; van Zeijl, Henk...
Sensors and Actuators A: Physical.  317 (2021)  - p. 112439 , 2021
Link: https://doi.org/10.1016/..
 
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14

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Liu, Pan ; Li, Jian ; Zeijl, Henk van. - p. 817-823 , 2020
Link: https://doi.org/10.1109/..
 
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15

Corrigendum to "Vaporizing liquid microthrusters with integ..:

Silva, Marsil A.C. ; Guerrieri, Daduí C. ; van Zeijl, Henk..
Sensors and Actuators A: Physical.  277 (2018)  - p. 102 , 2018
Link: https://doi.org/10.1016/..
 
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