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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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Effects of In/Zn composition on the Performance of Ultra-th..:
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2023 International Electron Devices Meeting (IEDM) ,
2
First Demonstration of Highly Scaled Atomic Layer Deposited..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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Aggressively Scaled Atomic Layer Deposited Amorphous InZnOx..:
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Proceedings of the 2009 Asia and South Pacific Design Automation Conference ,
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An 8.69 Mvertices/s 278 Mpixels/s tile-based 3D graphics So..:
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2019 IEEE 2nd International Conference on Knowledge Innovation and Invention (ICKII) ,
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A Cluster Model Applied to Power Consumption:
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2023 International Electron Devices Meeting (IEDM) ,
7
First Demonstration of Monolithic Self-aligned Heterogeneou..:
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2022 International Electron Devices Meeting (IEDM) ,
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First Demonstration of GAA Monolayer-MoS2 Nanosheet nFET wi..:
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2009 Asia and South Pacific Design Automation Conference ,
9
An 8.69 Mvertices/s 278 Mpixels/s tile-based 3D graphics So..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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15.7 A 32Mb RRAM in a 12nm FinFet Technology with a 0.0249μ..:
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2023 International Electron Devices Meeting (IEDM) ,
11
Status and Performance of Integration Modules Toward Scaled..:
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2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC) ,
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The color demosaicing and image scaling based on improve Ha..:
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2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) ,
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How to Backdoor Diffusion Models?:
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2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ,
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A Wi-Fi Tri-band switchable Transceiver with 57.9fs-RMS-jit..:
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