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Dai, Mingji
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1

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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2

Image Blending Methods for Defective PCB Image Generation:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,
Chiang, Ting-Hui ; Chang, Chun-Hao ; Chen, Li-Hsin... - p. 261-262 , 2022
Link: https://doi.org/10.1109/..
 
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3

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Zhang, Jie ; Lu, Wei ; Huang, Po-Tsang... - p. 262-263 , 2022
Link: https://doi.org/10.1109/..
 
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4

Application of large language models in professional fields:

, In: 2023 11th International Conference on Information Systems and Computing Technology (ISCTech),
Zhou, Mingji ; Chen, Wei ; Zhu, Senliang... - p. 142-146 , 2023
Link: https://doi.org/10.1109/..
 
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