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Eom, Jung-Ho
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1

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
Link: https://doi.org/10.1109/..
 
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2

Reliability of Indium Solder Joints using a Laser-Assisted ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Jung, Ji Eun ; Eom, Yong-Sung ; Joo, Jiho... - p. 2237-2243 , 2024
Link: https://doi.org/10.1109/..
 
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3

Augmenting Mobile Search Engine with Semantic Web and Conte..:

, In: Proceedings of the 2013 IEEE/WIC/ACM International Joint Conferences on Web Intelligence (WI) and Intelligent Agent Technologies (IAT) - Volume 03,
Shin, Sangjin ; Shin, Dong-Hoon ; Ko, Jihoon... - p. 278-279 , 2013
Link: https://dl.acm.org/doi/1..
 
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4

Modular EV Rapid Charger Design and Control Method:

, In: 2019 22nd International Conference on Electrical Machines and Systems (ICEMS),
Kim, Jun-Mo ; Lee, Jeong ; Eom, Tae-Ho... - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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5

Session details: Connecting online & offline life workshop ..:

, In: Proceedings of the 23rd International Conference on World Wide Web,
Ferrara, Emilio ; Ahn, Yong-Yeol ; Volkovich, Yana. , 2014
Link: https://dl.acm.org/doi/1..
 
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6

Mining communities in networks : a solution for consiste..:

, In: Proceedings of the 9th ACM SIGCOMM conference on Internet measurement,
Kwak, Haewoon ; Choi, Yoonchan ; Eom, Young-Ho.. - p. 301-314 , 2009
Link: https://dl.acm.org/doi/1..
 
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7

Comparison of online social relations in volume vs interact..:

, In: Proceedings of the 8th ACM SIGCOMM conference on Internet measurement,
Chun, Hyunwoo ; Kwak, Haewoon ; Eom, Young-Ho... - p. 57-70 , 2008
Link: https://dl.acm.org/doi/1..
 
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8

A Fundamental Study on a System for Estimating the Intentio..:

, In: 2023 International Conference on Electronics, Information, and Communication (ICEIC),
Park, Na-Yeon ; Eom, Su-Hong ; Ryu, Jung-Hwun. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Laser-Assisted Bonding with Compression (LABC) based Tiling..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1385-1389 , 2023
Link: https://doi.org/10.1109/..
 
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10

Process Window of Mini-LED Display Panel Packaging using La..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Eom, Yong-Sung ; Choi, Gwang-Mun ; Jang, Ki-Seok... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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11

Design Issues in Implementation of Decentralized AI-data co..:

, In: 2023 14th International Conference on Information and Communication Technology Convergence (ICTC),
Suh, Young-Ho ; Woo, Sungpil ; Eom, Boyun... - p. 1510-1512 , 2023
Link: https://doi.org/10.1109/..
 
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12

A Fast-Lock DLL with Prediction-Based Fast-Track FDL Struct..:

, In: 2023 IEEE 15th International Conference on ASIC (ASICON),
Pang, Gaoyuan ; Lee, Brian ; Jung, Jake. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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13

Pseudo differential DQS receiver for eliminating channel Hi..:

, In: 2023 IEEE 15th International Conference on ASIC (ASICON),
Zhang, Xueyan ; Lee, Brian ; Eom, Chris.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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14

A low power consumption and higher performance DDR5 receive..:

, In: 2023 IEEE 15th International Conference on ASIC (ASICON),
Tang, Elaine ; Lee, Brian ; Eom, Chris. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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15

Federated Learning in Prediction of Dementia Stage: An Expe..:

, In: 2023 14th International Conference on Information and Communication Technology Convergence (ICTC),
Eom, Boyun ; Zubair, Muhammad ; Park, Dong-Hwan... - p. 1785-1788 , 2023
Link: https://doi.org/10.1109/..
 
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