Fukuhara, H
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Contact angle between Sn-Ag-Cu solder and electroplated Cu-..:

, In: Proceedings of the 1st International Joint Symposium on Joining and Welding,
Nishikawa, H. ; Naoi, T. ; Saito, M... - p. 553-556 , 2013
 
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Endornavirus:

, In: Encyclopedia of Virology,
Fukuhara, T. ; Moriyama, H. - p. 109-116 , 2008
 
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