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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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A Study of JEDEC Board-Level Drop Test Performance Predicti..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
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21.3 A 5.69mm2 0.98nJ/Pixel Image-Processing SoC with 24b H..:
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2021 IEEE Fourth International Conference on Artificial Intelligence and Knowledge Engineering (AIKE) ,
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Deep Ensemble Learning Model for Long-Term Travel Time Pred..:
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Proceedings of the 2017 International Conference on Data Mining, Communications and Information Technology ,
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Exploring the knowledge diffusion trajectories for the VoIP..:
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Proceedings of the 51st Annual Design Automation Conference ,
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EC-Cache : Exploiting Error Locality to Optimize LDPC in..:
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Proceedings of the 2023 International Symposium on Physical Design ,
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Reshaping System Design in 3D Integration : Perspectives..:
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[ ] With Design: Reinventing Design Modes ,
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A Study on Colour Fidelity of Multi-colour 3D Printing for ..:
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Latest Material and Technological Developments for Activewear ,
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Activewear design for competition: case study for Hong Kong..:
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Proceedings of the 21st International Database Engineering & Applications Symposium ,
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Efficient Evaluation of Shortest Average Distance Query on ..:
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2022 IEEE 17th Conference on Industrial Electronics and Applications (ICIEA) ,
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Design of a Cascade Stacking Ensemble Algorithm Based on Mu..:
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Microfluidics for Pharmaceutical Applications ,
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Lab-on-a-chip fabrication of polymeric microparticles for d..:
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PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference. Digest of Papers (Cat. No.01CH37251) ,
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