Hsiao, Chih-ying
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1

Continuous and Discrete Time Modeling of Short-Term Interes..:

, In: Financial Econometrics Modeling: Derivatives Pricing, Hedge Funds and Term Structure Models,
Hsiao, Chih-Ying ; Semmler, Willi - p. 163-187 , 2011
 
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2

Optimizing Device Metal Routing Layouts by the Simulation T..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Huang, Shao-Chang ; Li, Ching-Ho ; Liao, Chih-Cherng... - p. 219-220 , 2023
 
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3

On-wafer Non-Fifty Ohm X-parameter Model Verification Measu..:

, In: 2019 IEEE Asia-Pacific Microwave Conference (APMC),
Hsiao, Hsu-Feng ; Tu, Chih-Ho ; Tsai, Hann-Huei. - p. 267-269 , 2019
 
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4

Air-Coupled Piezoelectric Micromachining Ultrasonic Transdu..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Kao, Chien-Lun ; Hsu, Han-Jen ; Lin, Hsiao-Chi... - p. 1-4 , 2023
 
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5

Development of Ultrasonic Shrimp Monitoring System Based on..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Lin, Fu-Sung ; Yang, Po-Wei ; Wu, Chia-Hsi... - p. 1-4 , 2022
 
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6

SenCu as a Sensing System to Experience Programming Design:

, In: 2022 IEEE International Conference on Teaching, Assessment and Learning for Engineering (TALE),
Chen, Ssu-Ying ; Hsieh, Yi-Jie ; Lo, Hsiao-Ju... - p. 99-104 , 2022
 
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7

Investigation of Machine Learning-Based Acoustic 2D Gas Pyr..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Lin, Fu-Sung ; Huang, Man-Ching ; Wu, Chia-Hsi... - p. 1-3 , 2022
 
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8

Contactless Ultrasound Droplet Manipulation System for Mixi..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
 
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9

An Application of Text Detection and Recognition for Electr..:

, In: 2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
 
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10

Social Media Prediction Based on Residual Learning and Rand..:

, In: Proceedings of the 25th ACM international conference on Multimedia,
Hsu, Chih-Chung ; Lee, Ying-Chin ; Lu, Ping-En... - p. 1865-1870 , 2017
 
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11

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
 
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12

FOODwell:

, In: Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems,
 
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13

Warpage Assessment of System in Wafer-level Package Technol..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
 
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14

Design and Development of a Prototype Upper-limb Rehabilita..:

, In: 2023 9th International Conference on Automation, Robotics and Applications (ICARA),
 
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15

A Wireless Power Transfer IoT Electronic Flower Pot System ..:

, In: 2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM),
 
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