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2020 IEEE 1st China International Youth Conference on Electrical Engineering (CIYCEE) ,
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A New Screening Method for Alleviating Transient Current Im..:
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2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring) ,
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Luminescence Property of Ce3+/Yb3+ Co-doped Silica Material..:
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Proceedings of the 2010 IEEE Workshop on Principles of Advanced and Distributed Simulation ,
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Federate Fault Tolerance in HLA-Based Simulation:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Adhesion Layer Influence on Thermomechanical Reliability of..:
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Proceedings of the 2023 International Conference on Advances in Artificial Intelligence and Applications ,
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Efficient Multi-Scale Attention Residual Network for Breast..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Optimal thermo-mechanical reliability design of 2.5D lidles..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Parametric Study of The Geometry Design of Through-silicon ..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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The Optimal Solution of Reflow Oven Recipe based on Physics..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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A Deep Learning Approach for Reflow Profile Prediction:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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A comparative study of the thermomechanical reliability of ..:
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Advances in Toxicology and Risk Assessment of Nanomaterials and Emerging Contaminants ,
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Micro- and Nanoplastic Pollution in Terrestrial Ecosystems:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
12
Characterization of Constitutive Equation of Sn-Bi by Study..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Shape Dependency of Fatigue Life in Solder Joints of Chip R..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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