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Lin, Haoliang
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1

Effect of Tg and modulus on the underfill reliability in pa..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhao, Guolin ; Lin, Haoliang ; Peng, Xiaohui.. - p. 564-568 , 2023
Link: https://doi.org/10.1109/..
 
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2

Study on the Hygrothermal Reliability of Underfill/Passivat..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Li, Zhipeng ; Wu, Wenjie ; Wang, Bin... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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3

Effects of Temperature on the Adhesive Performance of High ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Zhao, Guolin ; Yang, Yuanyuan ; Peng, Xiaohui... - p. 2275-2280 , 2022
Link: https://doi.org/10.1109/..
 
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4

Effect of Silane Coupling Agents on the Underfill Adhesion ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhao, Guolin ; Lin, Haoliang ; Zhang, Ruoyu... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Enhancement of Interfacial Adhesion in Underfill/Silicon fo..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Yuanyuan ; Wang, Bin ; Yang, Jinbao... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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6

The Effect of Toughening Agents on Capillary Underfill in t..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Yuanyuan ; Wu, Houya ; Peng, Tao... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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7

Multi-View Representation Learning via View-Aware Modulatio:

, In: Proceedings of the 31st ACM International Conference on Multimedia,
Wang, Ren ; Sun, Haoliang ; Nie, Xiushan... - p. 3876-3886 , 2023
Link: https://dl.acm.org/doi/1..
 
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