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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Understanding the Influence of Copper Substrate Oxidation o..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Sintered Micro-Silver Paste Doped with Indium for Die Attac..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Die Attachment on Bare Copper Surface by Non-Pressure Silve..:
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
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Micro-Silver Sinter Paste Developed for Pressure Sintering ..:
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2007 9th Electronics Packaging Technology Conference ,
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Properties of new solder paste system with ultra low residu..:
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2024 IEEE 7th International Conference on Soft Robotics (RoboSoft) ,
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Compliant Robotic Arm based on a Tensegrity Structure with ..:
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2023 IEEE International Ultrasonics Symposium (IUS) ,
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Real-time transcranial phase aberration correction using a ..:
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Methodologies and Results in Grapevine Research ,
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Marker Development for Important Grapevine Traits by Geneti..:
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Proceedings of the 6th International Conference on Mobile Technology, Application & Systems ,
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SySifoS : SystemC simulator for sensor and communication..:
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Proceedings of the conference on Design, automation and test in Europe - Volume 3 ,
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Verification of a Microcontroller IP Core for System-on-a-C..:
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Proceedings of the tenth annual conference on Computational learning theory ,
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