Dimitrov, N
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2

Enhanced voiding in Cu-Sn micro joints:

Njuki, M. ; Thekkut, S. ; Sivasubramony, R....
Materials Research Bulletin.  150 (2022)  - p. 111759 , 2022
 
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3

Preventing Void Growth Between Ni3Sn4 and Solder:

Njuki, M. ; Thekkut, S. ; Das, R...
Journal of Electronic Materials.  51 (2022)  11 - p. 6333-6346 , 2022
 
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6

Understanding and preventing Cu–Sn micro joint defects thro..:

Njuki, M. ; Thekkut, S. ; Das, R....
Journal of Applied Electrochemistry.  52 (2021)  2 - p. 259-271 , 2021
 
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8

Optical waveguiding by necklace and azimuthon beams in nonl..:

Stoyanov, L. ; Dimitrov, N. ; Stefanov, I...
Journal of the Optical Society of America B.  34 (2017)  4 - p. 801 , 2017
 
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9

Probabilistic model for multi-axial dynamic load combinatio..:

Dimitrov, N.
Engineering Structures.  117 (2016)  - p. 239-249 , 2016
 
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13

Superconformal Filling of Through Vias in Glass Interposers:

Ogutu, P. ; Fey, E. ; Dimitrov, N.
ECS Electrochemistry Letters.  3 (2014)  8 - p. D30-D32 , 2014
 
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15

Seeding strategies for the deposition of high density netwo..:

Kamundi, M. ; Bromberg, L. ; Ogutu, P..
Journal of Applied Electrochemistry.  43 (2013)  9 - p. 879-890 , 2013
 
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