E-LIB Suche - Ergebnisse für: Lai, Wei-Hong

1

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024

Link: https://doi.org/10.23919..

2

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024

Link: https://doi.org/10.1109/..

3

Electrochemical coupling in subnanometer pores/channels for..:

Lei, Yao-Jie ; Zhao, Lingfei ; Lai, Wei-Hong...
Chemical Society Reviews. 53 (2024) 8 - p. 3829-3895 , 2024

Link: https://doi.org/10.1039/..

4

Understanding the charge transfer effects of single atoms f..:

Lei, Yao-Jie ; Lu, Xinxin ; Yoshikawa, Hirofumi...
Nature Communications. 15 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

5

Lithium-Ion Charged Polymer Channels Flattening Lithium Met..:

Duan, Haofan ; You, Yu ; Wang, Gang...
Nano-Micro Letters. 16 (2024) 1 - p. , 2024

Link: https://doi.org/10.1007/..

6

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024

Link: https://doi.org/10.23919..

7

Increased Apolipoprotein A1 Expression Correlates with Tumo..:

Chang, Chih-Chia ; Chang, Chia-Bin ; Chen, Chiung-Ju...
Current Issues in Molecular Biology. 46 (2024) 3 - p. 2155-2165 , 2024

Link: https://doi.org/10.3390/..

8

Net zero emission goals demand worldwide cooperation:

Dou, Shi Xue ; Lai, Wei-Hong ; Cook, Chris
National Science Review. 10 (2023) 11 - p. , 2023

Link: https://doi.org/10.1093/..

9

Board-Level Drop Reliability Analysis for Fine-Pitch BGA Pa..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),

Lai, Wei-Hong ; Yang, Hung-Chun ; Hsu, Meng-Chi.. - p. 97-100 , 2023

Link: https://doi.org/10.1109/..

10

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023

Link: https://doi.org/10.1109/..

11

Regulating the oxidation state of copper centers in metal-o..:

Xie, Wenke ; Liu, Xuan-He ; Wang, Yun-Xiao..
Cell Reports Physical Science. 4 (2023) 10 - p. 101587 , 2023

Link: https://doi.org/10.1016/..

12

Reappraisal of hard carbon anodes for practical lithium/sod..:

LeGe, Niubu ; He, Xiang-Xi ; Wang, Yun-Xiao...
Energy & Environmental Science. 16 (2023) 12 - p. 5688-5720 , 2023

Link: https://doi.org/10.1039/..

13

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023

Link: https://doi.org/10.23919..

14

Reforming Magnet Waste to Prussian Blue for Sustainable Sod..:

Li, Qing-Yan ; Xu, Chunmei ; Liang, Ya-Ru...
ACS Applied Materials & Interfaces. 14 (2022) 42 - p. 47747-47757 , 2022

Link: https://doi.org/10.1021/..

15

Warpage and RDL Stress Analysis in Large Fan-Out Package wi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Wong, Jen-Hsien ; Wu, NanYi ; Lai, Wei-Hong... - p. 1074-1079 , 2022

Link: https://doi.org/10.1109/..