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2023 International Electron Devices Meeting (IEDM) ,
12
3D sequential integration with Si CMOS stacked on 28nm indu..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
13
Methodology for Active Junction Profile Extraction in thin ..:
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2022 International Electron Devices Meeting (IEDM) ,
14
3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
15