Wu, Shih-Hsien
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1

Reshaping System Design in 3D Integration : Perspectives..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Chen, Hung-Ming ; Ho, Chu-Wen ; Wu, Shih-Hsien... - p. 71-77 , 2023
 
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2

PIPPON: Improve Impedance Prediction of Power Distribution ..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
 
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3

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Zhang, Jie ; Lu, Wei ; Huang, Po-Tsang... - p. 262-263 , 2022
 
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4

A Design Flow for Micro Bump and Stripe Planning on Modern ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Huang, Ming-Yu ; Chen, Hung-Ming ; Chen, Kuan-Neng... - p. 2236-2241 , 2020
 
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10

Iron ore reduction using agricultural waste biochar with di..:

Chuanchai, Ajcharapa ; Wu, Keng-Tung ; Chen, In-Gann.
Journal of the Taiwan Institute of Chemical Engineers.  162 (2024)  - p. 105573 , 2024
 
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14

Swelling and softening behavior of iron ore-spent mushroom ..:

Reddy, Damodar S. ; Chang, Hao-Hsun ; Tsai, Meng-Yu...
Journal of Materials Research and Technology.  22 (2023)  - p. 1999-2007 , 2023
 
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15

The synergic effects of heat treatment and building directi..:

Wu, Ming-Wei ; Ku, Shu-Wei ; Yen, Hung-Wei...
Materials Science and Engineering: A.  887 (2023)  - p. 145744 , 2023
 
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