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1
Chip scale package (CSP)
design, materials, processes, reliability, and applications
Electronic packaging and interconnection series
Copies:
Zentrale: a elt 695 f/690
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2
8th International Conference on Hot-Wire CVD (Cat CVD) Proc..
Thin solid films ; volume 595, part B (2015)
Copies:
Zentrale:Magazinturm-E02 15z phy 957 jb/588-595
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3
Ziemlich beste Feinde
Internationale Politik ; 75. Jahr, Nr. 1 (Januar/Februar 2020)
Copies:
Zentrale:E02 z pol 700/300-75
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4
Information sharing in supply chains
improving the performance of collaboration
Operations and technology management ; vol. 3
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5
The management of enterprises in the People's Republic of C..:
Copies:
TB Nautik 15/9.2.1 Man. 1/Magazin
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6
Existence of the sectional capacity
Memoirs of the American Mathematical Society ; no. 690
Copies:
Zentrale:E02 a mat 090 z/598
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7
Columbia anthology of modern Chinese literature
Modern Asian literature series
Copies:
Zentrale:Magazinturm-E02 a ori 908/032
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8
Ts'ao Yü. The reluctant disciple of Chekhov and O'Neill. A..
Centre of Asian Studies. Series ; No. 2
Copies:
Zentrale:Magazinturm-E02 a ori 910 tsa 7/386
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