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AOKI, Risa
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Dimensional Parameters Controlling Capillary Underfill Flow..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Marushima, Chinami ; Aoki, Toyohiro ; Nakamura, Koki... - p. 586-590 , 2022
Link: https://doi.org/10.1109/..
 
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2

Solder and Organic Adhesive Hybrid Bonding Technology with ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Matsumoto, Keiji ; Watanabe, Takahito ; Miyazawa, Risa... - p. 340-346 , 2022
Link: https://doi.org/10.1109/..
 
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