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Ahsan, Kamrul
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1

Analysis of Hand Movement from Surface EMG Signals Using Ar..:

, In: Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; Machine Intelligence and Emerging Technologies,
Rajon, S. A. Ahsan ; Abid, Mahmudul Hasan ; Sikder, Niloy... - p. 68-78 , 2023
Link: https://doi.org/10.1007/..
 
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2

A Communication Aid System for Deaf and Mute using Vibrotac..:

, In: 2019 International Seminar on Application for Technology of Information and Communication (iSemantic),
Sobhan, Masrur ; Chowdhury, Mehrab Zaman ; Ahsan, Imamul.. - p. 184-190 , 2019
Link: https://doi.org/10.1109/..
 
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3

Creep and Microstructure Evolutions in SAC305 Lead Free Sol..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kamrul Hasan, S M ; Al Ahsan, Mohammad ; Suhling, Jeffrey C.. - p. 2191-2200 , 2022
Link: https://doi.org/10.1109/..
 
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4

Comparison of Thermal Cycling Induced Mechanical Property E..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Kamrul Hasan, S M ; Fahim, Abdullah ; Al Ahsan, Mohammad.. - p. 999-1017 , 2021
Link: https://doi.org/10.1109/..
 
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5

Effect of Different Thermal Cycling Profiles on the Mechani..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Al Ahsan, Mohammad ; Kamrul Hasan, S.M. ; Fahim, Abdullah.. - p. 1170-1179 , 2020
Link: https://doi.org/10.1109/..
 
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6

Correlation of Mechanical and Microstructural Evolutions in..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Al Ahsan, Mohammad ; Hasan, S M Kamrul ; Chakraborty, Souvik.. - p. 1460-1467 , 2024
Link: https://doi.org/10.1109/..
 
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7

The Effects of Thermal Exposure on the Creep Behavior of SA..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Ahsan, Mohammad Al ; Hasan, S M Kamrul ; Suhling, Jeffrey C.. - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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8

Evolution of the Creep Response of SAC+Bi Lead-Free Solders..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ahsan, Mohammad Al ; Hasan, S M Kamrul ; Suhling, Jeffrey C.. - p. 2054-2061 , 2023
Link: https://doi.org/10.1109/..
 
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9

Evolution of the Creep Behavior for SAC305 Lead Free Solder..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Hasan, S M Kamrul ; Al Ahsan, Mohammad ; Suhling, Jeffrey C.. - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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10

Mechanical Property Evolution in SAC+Bi Lead-Free Solders S..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Al Ahsan, Mohammad ; Hasan, S M Kamrul ; Haq, Mohammad Ashraful.. - p. 1637-1645 , 2022
Link: https://doi.org/10.1109/..
 
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11

The Effect of Bismuth Content on Mechanical Property Evolut..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Al Ahsan, Mohammad ; Hasan, S M Kamrul ; Suhling, Jeffrey C.. - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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12

Mechanical Property Evolution in SAC+Bi Lead Free Solders S..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Ahsan, Mohammad Al ; Hasan, S M Kamrul ; Fahim, Abdullah.. - p. 700-7007 , 2021
Link: https://doi.org/10.1109/..
 
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