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Akira Shinohara
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1

Effect of Bonding Position between Cu Wire and Al pad in TH..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Shinohara, Kazutaka ; Kobayashi, Tatsuya ; Miyota, Akira - p. 83-84 , 2023
Link: https://doi.org/10.23919..
 
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2

High carrier velocity and reliability of quarter-micron SPI..:

, In: 1992 International Technical Digest on Electron Devices Meeting,
Hon, Atsushi ; Hiroki, Akira ; Segawa, Mizuki... - p. 699-702 , 1992
Link: https://doi.org/10.1109/..
 
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