Alberto D'Angelo
131  results:
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1

Implementation and Comparison of SiC and GaN switches for E..:

, In: 2023 Asia Meeting on Environment and Electrical Engineering (EEE-AM),
 
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2

Fast Liquid-to-Liquid Thermal Shock: Experimental Assessmen..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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3

Thermography Analysis of Automotive SiC Power Modules for R..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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4

Thermal Impedance Computation of a SiC Power Module for Tra..:

, In: 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE),
 
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5

Intelligent Deep Motion Magnification Analysis in Advanced ..:

, In: 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE),
 
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6

Performances Evaluation of Electric Vehicles Recharging Sys..:

, In: Lecture Notes in Electrical Engineering; Proceedings of SIE 2023,
 
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7

Intelligent Optical Microscopy Defects Assessment of Silico..:

, In: 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE),
 
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8

Failure Strength Analysis and Young Modulus Assessment of 4..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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9

The reliability challenge of SiC Power Modules in Automotiv..:

, In: 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM),
 
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10

Geometrical Tolerances: "Planarity" Measurements on Automot..:

, In: Advances on Mechanics, Design Engineering and Manufacturing IV; Lecture Notes in Mechanical Engineering,
 
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11

Mechanical Characterization of Power Electronics Solder Mat..:

, In: Lecture Notes in Mechanical Engineering; Design Tools and Methods in Industrial Engineering II,
 
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12

An integrated approach to optimize solder joint reliability:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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13

Thermal measurement and numerical analysis for automotive p..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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14

The "first and euRopEAn siC eighT Inches pilOt liNe": a pro..:

, In: 2020 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE),
 
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15

Simulation of parasitic effects on Silicon Carbide devices ..:

, In: 2020 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE),
 
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