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2023 Asia Meeting on Environment and Electrical Engineering (EEE-AM) ,
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Implementation and Comparison of SiC and GaN switches for E..:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Fast Liquid-to-Liquid Thermal Shock: Experimental Assessmen..:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Thermography Analysis of Automotive SiC Power Modules for R..:
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2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) ,
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Thermal Impedance Computation of a SiC Power Module for Tra..:
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2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) ,
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Intelligent Deep Motion Magnification Analysis in Advanced ..:
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Lecture Notes in Electrical Engineering; Proceedings of SIE 2023 ,
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Performances Evaluation of Electric Vehicles Recharging Sys..:
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2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) ,
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Intelligent Optical Microscopy Defects Assessment of Silico..:
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Failure Strength Analysis and Young Modulus Assessment of 4..:
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2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) ,
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The reliability challenge of SiC Power Modules in Automotiv..:
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Advances on Mechanics, Design Engineering and Manufacturing IV; Lecture Notes in Mechanical Engineering ,
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Geometrical Tolerances: "Planarity" Measurements on Automot..:
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Lecture Notes in Mechanical Engineering; Design Tools and Methods in Industrial Engineering II ,
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Mechanical Characterization of Power Electronics Solder Mat..:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
12
An integrated approach to optimize solder joint reliability:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Thermal measurement and numerical analysis for automotive p..:
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2020 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) ,
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The "first and euRopEAn siC eighT Inches pilOt liNe": a pro..:
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2020 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) ,
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