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An, Q.
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1

High Spin Hall Angle doped BiSbX Topological Insulators usi..:

, In: 2022 IEEE 33rd Magnetic Recording Conference (TMRC),
York, B. ; Hai, P. ; Le, Q.... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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2

Smart community security management system based on big dat..:

, In: The International Conference on Forthcoming Networks and Sustainability (FoNeS 2022),
An, Q. - p. None , 2022
Link: https://doi.org/10.1049/..
 
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3

Dispersion compensating fibers for non-zero dispersion fibe..:

, In: Optical Fiber Communication Conference and Exhibit,
Wandel, M. ; Kristensen, P. ; Veng, T.... - p. 327,328,329 , 2002
Link: https://doi.org/10.1109/..
 
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4

Permittivity Characterization of Ferroelectric Thin-Film Ha..:

, In: 2023 Device Research Conference (DRC),
Abdulazhanov, S. ; Le, Q. H. ; Huynh, D. K.... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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5

A Compact 120 GHz LNA in 22 nm FD-SOI with Back-Gate Contro..:

, In: 2023 18th European Microwave Integrated Circuits Conference (EuMIC),
Rack, M. ; Nyssens, L. ; Le, Q. H.... - p. 386-389 , 2023
Link: https://doi.org/10.23919..
 
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6

Integration of a Stacked Contact MOL for Monolithic CFET:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Vega-Gonzalez, Victor ; Radisic, D. ; Chan, Bt... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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7

Radiation Event Extraction Algorithm for CMOS Cameras in Dy..:

, In: 2023 16th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI),
Gu, Jie ; N, Jiang ; Y, Hou. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

First demonstration of Two Metal Level Semi-damascene Inter..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Murdoch, G. ; O'Toole, M. ; Marti, G.... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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9

Integration of Al2O3 Etch Stop Layer in 21nm Pitch Dual-Dam..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Wu, C. ; Vega-Gonzalez, V. ; De Coster, H.... - p. 79-81 , 2022
Link: https://doi.org/10.1109/..
 
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10

Buried Power Rail Metal exploration towards the 1 nm Node:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Gupta, A. ; Radisic, D. ; Maes, J. W.... - p. 22.5.1-22.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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11

W-Band Noise Characterization with Back-Gate Effects for Ad..:

, In: 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Le, Q. H. ; Huynh, D. K. ; Wang, D.... - p. 131-134 , 2020
Link: https://doi.org/10.1109/..
 
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12

Behind the 'High Incidence of Lung Cancer':

, In: Chinese "Cancer Villages",
Q, Li ; Ajiang, Chen - p. 229-254 , 2020
Link: https://doi.org/10.2307/..
 
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13

Three-Layer BEOL Process Integration with Supervia and Self..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Vega-Gonzalez, V. ; Bekaert, J. ; Kesters, E.... - p. 19.3.1-19.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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14

Vorwort:

, In: Die neue Kommunikationswissenschaft,
L., M. ; Q., T. - p. 9-10 , 2003
Link: https://doi.org/10.1007/..
 
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15

Instance Segmentation Applied to Underground Infrastructure:

, In: Image Analysis and Processing - ICIAP 2023 Workshops; Lecture Notes in Computer Science,
Haenel, R. ; Semler, Q. ; Semin, E... - p. 3-14 , 2024
Link: https://doi.org/10.1007/..
 
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