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An, Seok Hwan
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1

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
Link: https://doi.org/10.1109/..
 
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2

A 3.0 Gb/s/pin 4th generation F-chip with Toggle 5.0 Specif..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Jo, Youngmin ; Kavala, Anil ; Kim, Tongsung... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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3

Laser-Assisted Bonding with Compression (LABC) based Tiling..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1385-1389 , 2023
Link: https://doi.org/10.1109/..
 
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4

Active Shift Control for Hybrid Electric Vehicles:

, In: 2022 IEEE Conference on Control Technology and Applications (CCTA),
Bang, Jae Sung ; Choi, Seok Hwan ; Hong, Dae Gi.. - p. 1037-1042 , 2022
Link: https://doi.org/10.1109/..
 
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5

Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 198-203 , 2022
Link: https://doi.org/10.1109/..
 
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6

Imaging in Myopic Glaucoma:

, In: OCT Imaging in Glaucoma,
Kim, Seok Hwan - p. 101-112 , 2021
Link: https://doi.org/10.1007/..
 
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7

Development of Digital Signage Modules composed of Mini-LED..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Jang, Ki-seok... - p. 1031-1036 , 2020
Link: https://doi.org/10.1109/..
 
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8

Optical Access and Transport Technologies for 5G and Beyond:

, In: 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC),
Doo, Kyeong-Hwan ; Kim, Kwangok ; Lee, Han Hyub... - p. 1-3 , 2019
Link: https://doi.org/10.23919..
 
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9

Development of Laser-Assisted Bonding with Compression (LAB..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Choi, Kwang-Seong ; Eom, Yong-Sung ; Moon, Seok Hwan... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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10

High Speed and Low Latency PON for 5G Networks:

, In: 2019 IEEE Photonics Society Summer Topical Meeting Series (SUM),
Chung, Hwan Seok - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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11

Silica filler content in NCP and its effects on the reliabi..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Alves Braganca, Wagno ; Eom, Yong-Sung ; Son, Jihye... - p. 1-8 , 2017
Link: https://doi.org/10.1109/..
 
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12

Performance analysis by burst overhead length in symmetric-..:

, In: 2015 International Conference on Information and Communication Technology Convergence (ICTC),
Kim, Kwang Ok ; Chung, Hwan Seok - p. 1163-1166 , 2015
Link: https://doi.org/10.1109/..
 
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13

Cost-effective next generation mobile fronthaul architectur..:

, In: OFC 2014,
Seung-Hyun Cho ; Heuk Park ; Hwan Seok Chung... - p. 1-3 , 2014
Link: https://doi.org/10.1364/..
 
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14

Field trial of direct-detection and multi-carrier based 100..:

, In: OFC 2014,
Kwangjoon Kim ; Chung, Hwan Seok ; Chang, Sun Hyok.. - p. 1-3 , 2014
Link: https://doi.org/10.1364/..
 
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15

A Study on Improved Authentication Technique in Cloud Compu..:

, In: Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing; Studies in Computational Intelligence,
Yang, Hwan-Seok - p. 131-140 , 2021
Link: https://doi.org/10.1007/..
 
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