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Bailey, C
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1

Design of a cost-effective waste to energy system with stor..:

, In: 2022 IEEE 7th International Energy Conference (ENERGYCON),
Bailey, C. ; Chowdhury, S. - p. 1-7 , 2022
Link: https://doi.org/10.1109/..
 
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2

Non-Diffracting Metallic Metasurfaces with High Directional..:

, In: 2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC),
Gorecki, J. ; Buchnev, O. ; Bailey, C.... - p. 1-1 , 2021
Link: https://doi.org/10.1109/..
 
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3

Introduction to adhesives joining technology for electronic:

, In: Advanced Adhesives in Electronics,
Alam, M.O. ; Bailey, C. - p. 1-12 , 2011
Link: https://doi.org/10.1533/..
 
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4

Contributor contact details:

, In: Advanced Adhesives in Electronics,
Alam, M.O. ; Bailey, C. ; Felba, J.... - p. ix-x , 2011
Link: https://doi.org/10.1016/..
 
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5

Modelling techniques used to assess conductive adhesive pro..:

, In: Advanced Adhesives in Electronics,
Bailey, C. - p. 199-213 , 2011
Link: https://doi.org/10.1533/..
 
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6

Thermal Analysis of LEDs for Liquid Crystal Display's Backl..:

, In: 2007 8th International Conference on Electronic Packaging Technology,
Yin, C. ; Lee, Y. ; Bailey, C.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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7

Application of Modeling for Predicting the behaviour of Pol..:

, In: Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics,
Bailey, C. ; Rizvi, J ; Yin, C.. - p. None , 2007
Link: https://doi.org/10.1109/..
 
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8

Thermo-Mechanical Analysis of the Packaging Process for Mic..:

, In: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems,
Yek Bing Lee ; Bailey, C. ; Hua Lu... - p. 1-6 , 2006
Link: https://doi.org/10.1109/..
 
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9

FPGA based video processing system for ubiquitous applicati..:

, In: Perspectives in Pervasive Computing,
Meng, H ; Pears, N E ; Bailey, C - p. 57-63 , 2005
Link: https://doi.org/10.1049/..
 
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10

Virtual manufacturing and design in the real world - implem..:

, In: Parallel Computational Fluid Dynamics 1999,
MCMANUS, K ; CROSS, M ; WALSHAW, C... - p. 47-56 , 2000
Link: https://doi.org/10.1016/..
 
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11

Virtual Manufacturing and Design in the Real World – Implem..:

, In: Parallel Computational Fluid Dynamics 1999,
McManus, K ; Cross, M ; Walshaw, C... - p. 47-56 , 2000
Link: https://doi.org/10.1016/..
 
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12

Parallel computer simulation of a chip bonding to a printed..:

, In: Parallel Computational Fluid Dynamics 1999,
CHOW, P ; BAILEY, C ; MCMANUS, K... - p. 173-178 , 2000
Link: https://doi.org/10.1016/..
 
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13

Parallel Computer Simulation of a Chip Bonding to a Printed..:

, In: Parallel Computational Fluid Dynamics 1999,
Chow, P. ; Bailey, C. ; McManus, K.... - p. 173-178 , 2000
Link: https://doi.org/10.1016/..
 
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14

Full Scale Fire Test on the New UK Slim Floor System:

, In: Advances in Steel Structures (ICASS '99),
BAILEY, C ; LENNON, T ; MOORE, D - p. 1055-1062 , 1999
Link: https://doi.org/10.1016/..
 
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15

The terms of a contract:

, In: Commercial Contracts,
Thorpe, C P ; Bailey, J C L - p. 75-106 , 1996
Link: https://doi.org/10.1016/..
 
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