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Bex, A.
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1

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
Link: https://doi.org/10.1109/..
 
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2

Multi-tier die stacking through collective die-to-wafer hyb..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Lin, Ye ; Suhard, Samuel... - p. 637-642 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; D'have, Koen ; Okudur, Oguzhan Orkut... - p. 1410-1417 , 2023
Link: https://doi.org/10.1109/..
 
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4

Integration of plasma dicing in the collective die to wafer..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Suhard, Samuel ; Kennes, Koen ; Bex, Pieter... - p. 144-149 , 2023
Link: https://doi.org/10.1109/..
 
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5

Justification, stability and relevance for case-based reaso..:

, In: Proceedings of the Nineteenth International Conference on Artificial Intelligence and Law,
Odekerken, Daphne ; Bex, Floris ; Prakken, Henry - p. 177-186 , 2023
Link: https://dl.acm.org/doi/1..
 
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6

Model- and data-agnostic justifications with A Fortiori Cas..:

, In: Proceedings of the Nineteenth International Conference on Artificial Intelligence and Law,
Peters, Joeri G.T. ; Bex, Floris J. ; Prakken, Henry - p. 207-216 , 2023
Link: https://dl.acm.org/doi/1..
 
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7

Voltage Support and Electrical Stresses in MMC-HVDC Systems..:

, In: 2023 IEEE PES Innovative Smart Grid Technologies Europe (ISGT EUROPE),
Bex, Lucas ; Liu, Xiaoxiao ; Leterme, Willem.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

Explaining Model Behavior with Global Causal Analysis:

, In: Communications in Computer and Information Science; Explainable Artificial Intelligence,
Robeer, Marcel ; Bex, Floris ; Feelders, Ad. - p. 299-323 , 2023
Link: https://doi.org/10.1007/..
 
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9

Highly Optimized O-band Si Ring Modulators for Low-Power Hy..:

, In: 2023 Optical Fiber Communications Conference and Exhibition (OFC),
Ban, Yoojin ; Kim, Minkyu ; De Heyn, Peter... - p. 1-3 , 2023
Link: https://doi.org/10.1364/..
 
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10

Seasonal Performance of Fitted Q-iteration for Space Heatin..:

, In: 2023 IEEE PES Innovative Smart Grid Technologies Europe (ISGT EUROPE),
Bex, Lucas ; Peirelinck, Thijs ; Deconinck, Geert - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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11

Carrier Systems for Collective Die-to-Wafer Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Phommahaxay, Alain ; Guerrero, Alice... - p. 2058-2063 , 2022
Link: https://doi.org/10.1109/..
 
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12

(Why do we need) Wireless Heterogeneous Integration (anyway..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Peeters, M. ; Sinha, S. ; Sun, X.... - p. 256-257 , 2022
Link: https://doi.org/10.1109/..
 
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13

Cost-effective RF interposer platform on low-resistivity Si..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sun, X. ; Slabbekoorn, J. ; Sinha, S.... - p. 7-11 , 2022
Link: https://doi.org/10.1109/..
 
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14

Effect of Anthropomorphic Glyph Design on the Accuracy of C..:

, In: Extended Abstracts of the 2022 CHI Conference on Human Factors in Computing Systems,
Pandey, Aditeya ; Bex, Peter ; Borkin, Michelle A. - p. 1-7 , 2022
Link: https://dl.acm.org/doi/1..
 
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15

Mining CryptoNight-Haven on the Varium C1100 Blockchain Acc..:

, In: 2022 32nd International Conference on Field-Programmable Logic and Applications (FPL),
Bex, Lucas ; Turan, Furkan ; Van Beirendonck, Michiel. - p. 452-453 , 2022
Link: https://doi.org/10.1109/..
 
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