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2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) ,
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SOI pMOS drain leakage understanding based on TCAD and meas..:
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2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) ,
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Doped Channel SOI pMOS TCAD Description Including Floating ..:
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2023 International Electron Devices Meeting (IEDM) ,
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3D sequential integration with Si CMOS stacked on 28nm indu..:
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2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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SmartSiC™ for Manufacturing of SiC Power Devices:
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2022 International Electron Devices Meeting (IEDM) ,
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3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling..:
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2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
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Comparative experimental study of junctionless and inversio..:
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2020 IEEE Symposium on VLSI Technology ,
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All-operation-regime characterization and modeling of drain..:
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2020 IEEE Symposium on VLSI Technology ,
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First demonstration of low temperature $(\leq 500^{\circ}\m..:
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IGARSS 2019 - 2019 IEEE International Geoscience and Remote Sensing Symposium ,
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Seasonal Dependence of SMAP Radiometer-Based Soil Moisture ..:
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IGARSS 2019 - 2019 IEEE International Geoscience and Remote Sensing Symposium ,
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A Method for Assessing SMAP Core Validation Site Scaling Bi..:
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2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) ,
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Novel Fine-Grain Back-Bias Assist Techniques for 14nm FDSOI..:
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2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) ,
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Back-bias impact on variability and BTI for 3D-monolithic 1..:
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2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) ,
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Laser Processing For 3D Junctionless Transistor Fabrication:
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Conference Proceedings of the Society for Experimental Mechanics Series; Dynamic Substructures, Volume 4 ,
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