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Brun, Lukas C.
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1

The "lightness" of Industry 4.0 lead firms: implications fo..:

, In: Transforming Industrial Policy for the Digital Age,
Brun, Lukas ; Gereffi, Gary ; Zhan, James , 2019
Link: https://doi.org/10.4337/..
 
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2

Assessing State-Level Science and Technology Policies:

, In: The Oxford handbook of local competitiveness / ed. by David B. Audretsch, Albert N. Link and Mary Lindenstein Walshok
Hardin, John ; Brun, Lukas ; Lanahan, Lauren. (2015) 
Link: https://doi.org/10.1093/..

Copies:  Zentrale:E02 a vwl 463/129; BB WiWi: 11a vwl 463/129a
 
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3

List of Contributors:

, In: Manson's Tropical Diseases,
Adebajo, Adewale O. ; Adu, Dwomoa ; Ahmed, Yusuf... - p. xii-xix , 2009
Link: https://doi.org/10.1016/..
 
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4

Local- Scale Spectroscopic Studies of Vortex Organization i..:

, In: The Oxford handbook of small superconductors / edited by A.V. Narlikar
Roditchev, D. ; Cren, T. ; Brun, C... (2017) 
Link: https://doi.org/10.1093/..
 
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5

Introduction to the Physics of Molten Salt Reactors:

, In: NATO Science for Peace and Security Series B: Physics and Biophysics; Materials Issues for Generation IV Systems,
Merle-Lucotte, E. ; Heuer, D. ; Allibert, M... - p. 501-521 , 2008
Link: https://doi.org/10.1007/..
 
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6

Same size mold chase technology for effective stack die arc..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Deb, N. ; Tomita, Y. ; Brun, X. F.... - p. 29-33 , 2023
Link: https://doi.org/10.1109/..
 
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7

Selective Epoxy Mold Compound Slurry for Advanced Packaging..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Widodo, T. S. ; Brun, X. F. ; Tsunoda, N.... - p. 1271-1276 , 2022
Link: https://doi.org/10.1109/..
 
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8

Ultra-thin mold cap for Advanced Packaging Technology:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Deb, N. ; Brun, X. F. ; Masuyama, C.... - p. 43-49 , 2022
Link: https://doi.org/10.1109/..
 
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9

List of Contributors:

, In: Biology and Engineering of Stem Cell Niches,
Ahmed, Abu S.I. ; Anversa, Piero ; Apoorva, Fnu... - p. xi-xiii , 2017
Link: https://doi.org/10.1016/..
 
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10

2.16µm Back Side Illuminated Voltage Domain Global Shutter ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Malinge, P. ; Lalanne, F. ; Herault, D.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Direct Measurements and Modeling of Avalanche Dynamics and ..:

, In: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC),
Rideau, D. ; Uhring, W. ; Bianchi, R. A.... - p. 144-147 , 2023
Link: https://doi.org/10.1109/..
 
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12

List of Contributors:

, In: Diffusion MRI of the Breast,
Amornsiripanitch, Nita ; Anaby, Debbie ; Arango-Lievano, Margarita... - p. v-ix , 2023
Link: https://doi.org/10.1016/..
 
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13

Enabling Next Generation 3D Heterogeneous Integration Archi..:

, In: 2022 International Electron Devices Meeting (IEDM),
Elsherbini, A. ; Jun, K. ; Liff, S.... - p. 27.3.1-27.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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14

IoT European Security and Privacy Projects: Integration, Ar..:

, In: Next Generation Internet of Things – Distributed Intelligence at the Edge and Human-Machine Interactions,
Ferrera, Enrico ; Pastrone, Claudio ; Brun, Paul-Emmanuel... - p. 207-292 , 2022
Link: https://doi.org/10.1201/..
 
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15

List of Contributors:

, In: New and Future Developments in Microbial Biotechnology and Bioengineering,
Aamir, Mohd. ; Altaf, Mohd Musheer ; Alves, Eliana A.... - p. ix-xi , 2019
Link: https://doi.org/10.1016/..
 
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