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Chai, Kevin
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1

A Continuous-Time Ising Machine using Coupled Inverter Chai..:

, In: 2023 IEEE Custom Integrated Circuits Conference (CICC),
Yu, Chengshuo ; Mu, Junjie ; Chai, Kevin.. - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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2

Towards a Discipline of Multimodality: Parallels to Mathema..:

, In: Multimodality,
O'Halloran, Kay L. ; Tan, Sabine ; Wignell, Peter... - p. 93-112 , 2019
Link: https://doi.org/10.1515/..
 
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3

How much money do spammers make from your website?:

, In: Proceedings of the CUBE International Information Technology Conference,
Hayati, Pedram ; Firoozeh, Nazanin ; Potdar, Vidyasagar. - p. 732-739 , 2012
Link: https://dl.acm.org/doi/1..
 
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4

Effect of Tapered Angle on BAW Transducer Performance for U..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Yang, Zaifeng ; Tan, Xing Haw Marvin ; Bui, Viet Phuong... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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5

MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo..:

, In: 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS),
Trivedi, Shyam ; Yeo, Yi Xuan ; Sarafianou, Mantalena... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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6

Novel Simulation Of Ultrasonic Attenuation In Fourier Trans..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Tan, Xing Haw Marvin ; Chen, Daniel Ssu-Han ; Bui, Viet Phuong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

Determining Damping Loss in Modeling GHz Acoustic Block thr..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Yang, Zaifeng ; Marvin Tan, Xing Haw ; Chen, Daniel Ssu-Han... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

A Novel Transpose 2T-DRAM based Computing-in-Memory Archite..:

, In: 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS),
Zhao, Yuansheng ; Shen, Zixuan ; Xu, Jiarui... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Recent Advances and Challenges of 2D Fourier Transform Comp..:

, In: 2023 IEEE 23rd International Conference on Nanotechnology (NANO),
Chen, Daniel Ssu-Han ; Teo, Yong Shun ; Yeo, Yi Xuan... - p. 1042-1047 , 2023
Link: https://doi.org/10.1109/..
 
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10

Novel Hybrid Simulation Of Large 128 By 128 Pixels Input To..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Juan, Zibo ; Chen, Daniel Ssu-Han ; Teo, Yong Shun... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

A 1800μm2, 953Gbps/W AES Accelerator for IoT Applications i..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Lan, Jingjing ; Nambiar, Vishnu P. ; Wong, Ming Ming... - p. 2433-2437 , 2022
Link: https://doi.org/10.1109/..
 
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12

SonicFFT: A system architecture for ultrasonic-based FFT ac..:

, In: 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC),
Patel, Darayus Adil ; Bui, Viet Phuong ; Chai, Kevin Tshun Chuan.. - p. 345-351 , 2022
Link: https://doi.org/10.1109/..
 
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13

Investigation of Au-AuSn Bonding Below Eutectic Temperature..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Daniel S.H. ; Wai, Eva L.C. ; Yeo, Yi Xuan... - p. 315-320 , 2022
Link: https://doi.org/10.1109/..
 
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14

A Study of Bonding Materials for GHz Ultrasonic Wavefront C..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Chen, Daniel Ssu-Han ; Sarafianou, Mantalena ; Wai, Eva Leong Ching... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

An Automatic Chip-Package Co-Design Flow for Multi-core Neu..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lan, Jingjing ; Nambiar, Vishnu P. ; Sabapathy, Rheeshaalaen... - p. 77-80 , 2020
Link: https://doi.org/10.1109/..
 
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