Chang, Dao-Ming
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1

Impact of Hot Carrier Stress on RF Power Characteristics of..:

, In: IEEE MTT-S International Microwave Symposium Digest, 2005.,
Huang, Sheng-Yi ; Chen, Kun-Ming ; Huang, Guo-Wei... - p. 161-164 , 2005
 
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2

Convolutional Neural Network-based Keyword Classification f..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Hung, Ying-Hsiu ; Chang, Yen-Ching ; Wang, Suz-Ting... - p. 181-182 , 2023
 
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3

Managing disruption risks in supply chain:

, In: 2010 IEEE International Conference on Emergency Management and Management Sciences,
Li Feng ; Hou Jun-qi ; Xu Dao-ming - p. 434-438 , 2010
 
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4

A Quasi-Two-Dimensional Threshold Voltage Model for Fully D..:

, In: 2008 4th International Conference on Wireless Communications, Networking and Mobile Computing,
 
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5

The analysis and modeling of on-resistance in high-voltage ..:

, In: 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings,
Ke, Dao-Ming ; Chen, Jun-Ning ; Shan-Gao. - p. None , 2006
 
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6

Size Effects on Deformation and Fracture of Nanostructured ..:

, In: Nanostructured Coatings; Nanostructure Science and Technology,
Moser, Benedikt ; Schwaiger, Ruth ; Dao, Ming - p. 27-77 , 2006
 
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7

Size Effects on Deformation and Fracture of Nanostructured ..:

, In: Nanostructured Coatings; Nanostructure Science and Technology,
 
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8

Study on Development Strategy of HL Reservoir Air Injection..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,
Zhao, Ze-qi ; Xi, Chang-feng ; Qi, Zong-yao... - p. 508-520 , 2024
 
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9

A Study of Underfill Dispensing Patterns in Flip-Chip Packa..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Dao-Long ; Chang, Hui-Jing ; Chen, Tang-Yuan... - p. 115-116 , 2023
 
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10

Warpage and RDL Stress Analysis in Large Fan-Out Package wi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wong, Jen-Hsien ; Wu, NanYi ; Lai, Wei-Hong... - p. 1074-1079 , 2022
 
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11

Development and Application of the Moisture-Dependent Visco..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yang, Chia-Ming ; Chiu, Tz-Cheng ; Yin, Wei-Jie... - p. 746-753 , 2022
 
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12

A Programmable Pressure Cuff at Fingertip to Aid Sepsis Det..:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
Luo, Dao-Heng ; Wu, Bing-Ruei ; Yang, Ming. - p. 1-2 , 2022
 
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13

A Mechanics Model for the Moisture Induced Delamination in ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chiu, Tz-Cheng ; Wu, Ji-Yen ; Liu, Wei-Te... - p. 1205-1211 , 2020
 
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14

Point-to-Point Offline Authentication Consensus Algorithm i..:

, In: Lecture Notes in Computer Science; Artificial Intelligence and Security,
Du, Xiao-Feng ; Lu, Yue-Ming ; Han, Dao-Qi - p. 655-663 , 2020
 
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15

Prognosis, Prevention and Research Prospects of Progression..:

, In: Acute Exacerbation of Chronic Hepatitis B,
Wang, Yu-Ming ; Yang, Dao-Feng ; Wang, Ming... - p. 457-497 , 2019
 
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