E-LIB Suche - Ergebnisse für: Chang, Je-Ken

1

Wireless Precise Positioning Technology With Application to..:

, In: 2023 IEEE International Conference on e-Business Engineering (ICEBE),

Chang, Je-Yao ; Lo, Tsu-Yu ; Wei, Tan Zhi... - p. 270-275 , 2023

Link: https://doi.org/10.1109/..

2

A Generic High-Availability Solution to Next-Generation Mob..:

, In: 2023 2nd International Conference on 6G Networking (6GNet),

Chen, Yi ; Chen, Chien ; Chang, Je-Wei. - p. 1-8 , 2023

Link: https://doi.org/10.1109/..

3

Non-Destructive Evaluation of Thermal Interface Materials u..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),

Kulkarni, Piyush ; Zhang, Zechen ; Rafsanjani, Fatemeh Hejripour... - p. 1-6 , 2022

Link: https://doi.org/10.1109/..

4

Spatial Thermal Conductivity Variation of Particulate-Fille..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),

Zhang, Zechen ; Kulkarni, Piyush A ; Daeumer, Matthias... - p. 1-7 , 2022

Link: https://doi.org/10.1109/..

5

Performances of Two-Phase Cooling Technologies that Uses Wa..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),

Diglio, Paul ; Shia, David ; Tadayon, Pooya.. - p. 86-92 , 2021

Link: https://doi.org/10.1109/..

6

Deep Priors Inside an Unrolled and Adaptive Deconvolution M..:

, In: Computer Vision – ACCV 2020; Lecture Notes in Computer Science,

Ko, Hung-Chih ; Chang, Je-Yuan ; Ding, Jian-Jiun - p. 371-388 , 2021

Link: https://doi.org/10.1007/..

7

Corrosion in Liquid Cooling Systems with Water-Based Coolan..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),

Kini, Girish ; Kim, Choong-Un ; Madanipour, H.... - p. 422-428 , 2020

Link: https://doi.org/10.1109/..

8

Corrosion in Liquid Cooling Systems with Water-Based Coolan..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),

Kim, Choong-Un ; Ni, Geng ; Kini, Girish... - p. 429-434 , 2020

Link: https://doi.org/10.1109/..

9

Investigating Users' Inclination of Leveraging Mobile Crowd..:

, In: Companion Publication of the 2023 Conference on Computer Supported Cooperative Work and Social Computing,

Chiang, You-Hsuan ; Hsu, Je-Wei ; Liu, Chung-En... - p. 338-342 , 2023

Link: https://dl.acm.org/doi/1..

10

A 28nm Nonvolatile AI Edge Processor using 4Mb Analog-Based..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Wen, Tai-Hao ; Hung, Je-Min ; Hsu, Hung-Hsi... - p. 1-2 , 2023

Link: https://doi.org/10.23919..

11

Enhancing User Experience in VR using Wearable Olfactory Sy..:

, In: Proceedings of the 29th ACM Symposium on Virtual Reality Software and Technology,

Myung, Je-Won ; Choi, Ye-Chan ; Park, Si-Yeon... - p. 1-2 , 2023

Link: https://dl.acm.org/doi/1..

12

A Nonvolatile Al-Edge Processor with 4MB SLC-MLC Hybrid-Mod..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),

Huang, Wei-Hsing ; Wen, Tai-Hao ; Hung, Je-Min... - p. 15-17 , 2023

Link: https://doi.org/10.1109/..

13

Any-Angle Routing for Redistribution Layers in 2.5D IC Pack..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),

Chung, Min-Hsuan ; Chuang, Je-Wei ; Chang, Yao-Wen - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

14

An 8-Mb DC-Current-Free Binary-to-8b Precision ReRAM Nonvol..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),

Hung, Je-Min ; Huang, Yen-Hsiang ; Huang, Sheng-Po... - p. 1-3 , 2022

Link: https://doi.org/10.1109/..

15

Reliable Computing of ReRAM Based Compute-in-Memory Circuit..:

, In: Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design,

Chang, Meng-Fan ; Hung, Je-Ming ; Chen, Ping-Cheng. - p. 1-6 , 2022

Link: https://dl.acm.org/doi/1..