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Chang, Shih-chi
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1

Constructing a Cross-Disciplinary Idea Convergence System U..:

, In: 2023 27th International Conference Information Visualisation (IV),
Li, Jia-Rong ; Huang, Hsin-Yi ; Chang, Teng-Wen.. - p. 352-357 , 2023
Link: https://doi.org/10.1109/..
 
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2

Discussion on Preliminary Digital Assistance Mode in the Em..:

, In: 2023 27th International Conference Information Visualisation (IV),
Chang, Teng-Wen ; Shih, Chi-Chi ; Chien, Hsiang-Ting... - p. 368-373 , 2023
Link: https://doi.org/10.1109/..
 
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3

Developing an Emotional Interaction Design for Social Anxie..:

, In: Communications in Computer and Information Science; HCI International 2023 Posters,
Chien, HsiangTing ; Huang, Hsin-Yi ; Chang, Teng-Wen... - p. 33-40 , 2023
Link: https://doi.org/10.1007/..
 
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4

Empathy Game: Using the Game as SPRINT Warm-Up Process in a..:

, In: Lecture Notes in Computer Science; HCI in Games,
Shih, Chi-Chi ; Chang, Teng-Wen ; Tsai, Shih-Ting... - p. 386-396 , 2023
Link: https://doi.org/10.1007/..
 
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5

Applying Data-driven Visualization with Seven-Step Process ..:

, In: 2022 26th International Conference Information Visualisation (IV),
Shih, Chi-Chi ; Chang, Teng-Wen ; Fang, Yu-Cyuan. - p. 180-185 , 2022
Link: https://doi.org/10.1109/..
 
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6

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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7

Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 399-403 , 2024
Link: https://doi.org/10.1109/..
 
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8

Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Yang, Shih-Chi ; Ong., Jia-Juen ; Tran, Dinh-Phuc... - p. 13-14 , 2023
Link: https://doi.org/10.23919..
 
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9

Demonstration of High Endurance Capability on Mega-Bit RRAM..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Yang, Chang-Feng ; Wu, Chun-Yu ; Shih, Meng-Chun... - p. 318-319 , 2022
Link: https://doi.org/10.1109/..
 
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10

Accelerating Transmission of Streaming Files Based on AL-FE..:

, In: 2021 IEEE 45th Annual Computers, Software, and Applications Conference (COMPSAC),
Chang, Shih-Ying ; Chiao, Hsin-Ta ; Sheu, Ruey-Kai.. - p. 1188-1193 , 2021
Link: https://doi.org/10.1109/..
 
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11

15.2 A 28nm 64Kb Inference-Training Two-Way Transpose Multi..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Su, Jian-Wei ; Si, Xin ; Chou, Yen-Chi... - p. 240-242 , 2020
Link: https://doi.org/10.1109/..
 
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12

Industrially Applicable Read Disturb Model and Performance ..:

, In: 2020 IEEE Symposium on VLSI Technology,
Yang, Chang-Feng ; Wu, Chun-Yu ; Yang, Ming-Han... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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13

More Than just Fame: Learning from Internet Celebrities—Use..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Yen, Wan-Hsuan ; Chang, Chi-Cheng ; Chou, Shih-Chi - p. 407-416 , 2019
Link: https://doi.org/10.1007/..
 
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14

The Relationship Between Academic Stress and Health Status—..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Chou, Shih-Chi ; Chang, Chi-Cheng - p. 685-694 , 2019
Link: https://doi.org/10.1007/..
 
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15

Searching toward pareto-optimal device-aware neural archite..:

, In: Proceedings of the International Conference on Computer-Aided Design,
Cheng, An-Chieh ; Dong, Jin-Dong ; Hsu, Chi-Hung... - p. 1-7 , 2018
Link: https://dl.acm.org/doi/1..
 
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