Chang, Tsung-Hao
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1

Embracing Uncertainty: A Diffusion Generative Model of Spec..:

, In: 2023 International Conference on Wireless Communications and Signal Processing (WCSP),
Wang, Hao ; Tang, Zhiwei ; Zhang, Shutao.. - p. 880-885 , 2023
 
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2

A Nonvolatile Al-Edge Processor with 4MB SLC-MLC Hybrid-Mod..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Huang, Wei-Hsing ; Wen, Tai-Hao ; Hung, Je-Min... - p. 15-17 , 2023
 
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3

Challenge of Anomaly Detection in IoT Analytics:

, In: 2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
 
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4

34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024
 
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5

15.3 A 3nm FinFET 4.3GHz 21.1Mb/mm2 Double-Pumping 1-Read a..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
 
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6

33.1 A 16nm 32Mb Embedded STT-MRAM with a 6ns Read-Access T..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Po-Hao ; Lee, Chia-Fu ; Shih, Yi-Chun... - p. 494-496 , 2023
 
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7

A 3-nm 27.6-Mbit/mm2 Self-timed SRAM Enabling 0.48 - 1.2 V ..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
 
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8

A 28nm Nonvolatile AI Edge Processor using 4Mb Analog-Based..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wen, Tai-Hao ; Hung, Je-Min ; Hsu, Hung-Hsi... - p. 1-2 , 2023
 
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9

A 4nm 6163-TOPS/W/b $\mathbf{4790-TOPS/mm^{2}/b}$ SRAM Base..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Mori, Haruki ; Zhao, Wei-Chang ; Lee, Cheng-En... - p. 132-134 , 2023
 
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10

An 8-Mb DC-Current-Free Binary-to-8b Precision ReRAM Nonvol..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
 
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11

13.3 A 22nm 32Mb Embedded STT-MRAM with 10ns Read Speed, 1M..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Chih, Yu-Der ; Shih, Yi-Chun ; Lee, Chia-Fu... - p. 222-224 , 2020
 
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12

High-Endurance MoS2 FeFET with Operating Voltage Fess Than ..:

, In: 2023 International Electron Devices Meeting (IEDM),
 
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13

A PCBA Solder Joint Defects Inspection System Based on Deep..:

, In: 2023 IEEE International Conference on Consumer Electronics (ICCE),
 
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14

Monolayer-MoS2 Stacked Nanosheet Channel with C-type Metal ..:

, In: 2023 International Electron Devices Meeting (IEDM),
 
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15

Vascular Disorders of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Hsu, Wen-Hung ; Yu, Fang-Jung ; Wu, Deng-Chyang... - p. 69-84 , 2023
 
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