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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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Oriented electrospun carbon nanofibers for improved through..:
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Communications in Computer and Information Science; Learning Technology for Education Challenges ,
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The Effect of Online Instructors' Immediacy and Presence on..:
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Communications in Computer and Information Science; Learning Technology for Education Challenges ,
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Teacher Fatigue, Social-Emotional Learning, Online Teaching..:
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Communications in Computer and Information Science; Learning Technology for Education Challenges ,
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Compassion Fatigue Among Pre-service Teachers During Online..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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A Study of Silicon-based Oxide Fluorescent Nanofibers by El..:
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2022 IEEE International Conference on Mechatronics and Automation (ICMA) ,
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A Real-time Artificial Intelligence Recognition System on C..:
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Communications in Computer and Information Science; HCI International 2020 - Posters ,
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The Learning Behaviors Analysis in a Language Learning Supp..:
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Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; Wireless Internet ,
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An Efficient MapReduce-Based Apriori-Like Algorithm for Min..:
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HCI in Business, Government and Organizations. Information Systems and Analytics; Lecture Notes in Computer Science ,
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A Medical Decision Support System Using Text Mining to Comp..:
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Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; Wireless Internet ,
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A Robust Remote Authentication Scheme for M-Commerce Enviro..:
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2008 International Conference on Control, Automation and Systems ,
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Theory thermal growth control techniques of high speed spin..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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Contact Optimization Through Annealing and Edge Functionali..:
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2024 Device Research Conference (DRC) ,
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Demonstration of Record Breakdown up to 13.5 kV in NiO/β-Ga..:
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2023 International Electron Devices Meeting (IEDM) ,
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Status and Performance of Integration Modules Toward Scaled..:
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2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ,
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