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Chen, Guoqi
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1

Contributors:

, In: Resistance to Anti-Cd20 Antibodies and Approaches for their Reversal,
Abdullahi, Hamisu ; Abubakar, Sharafudeen Dahiru ; Aliyu, Mansur... - p. xxi-xxiii , 2024
Link: https://doi.org/10.1016/..
 
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2

Double-sided heat dissipation numerical modeling of an embe..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Li, Wenyu ; Chen, Wei ; Jiang, Jing... - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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3

Multi-Objective Optimization of a 1200-V Fan-Out Panel-Leve..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yan, Xuyang ; Chen, Wei ; Li, Wenyu... - p. 2143-2149 , 2024
Link: https://doi.org/10.1109/..
 
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4

Thermal-mechanical-electrical Co-design of Fan-Out Panel-Le..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Wei ; Yan, Xuyang ; Ibrahim, Mesfin S.... - p. 2007-2011 , 2023
Link: https://doi.org/10.1109/..
 
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5

Spatiotemporal Task Allocation in Mobile Crowdsensing:

, In: Wireless Networks; Mobile Crowdsourcing,
Chen, Honglong ; Ma, Guoqi ; Huang, Yang - p. 163-189 , 2023
Link: https://doi.org/10.1007/..
 
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6

Massively Parallel DGTD with Alternate-Buffer Remote Memory..:

, In: 2023 International Applied Computational Electromagnetics Society Symposium (ACES-China),
Li, Minxuan ; Xu, Pengfei ; Wang, Guoqi.. - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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7

Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Ph..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Wen, Minzhen ; Guo, Baotong ; Chen, Shanghuan... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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8

Generating Dynamic Kernels via Transformers for Lane Detect..:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Chen, Ziye ; Liu, Yu ; Gong, Mingming... - p. 6812-6821 , 2023
Link: https://doi.org/10.1109/..
 
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9

The Fault System of Fula Sag, Muglad Basin and Its Hydrocar..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022,
Wang, Yan-qi ; Wei, Guo-qi ; Zhang, Guang-ya... - p. 1143-1161 , 2023
Link: https://doi.org/10.1007/..
 
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10

Cyber-Physical Systems Design in An Uncertain Environment w..:

, In: 2023 IEEE 29th International Conference on Parallel and Distributed Systems (ICPADS),
Chen, Si ; Huang, Lida ; Xiao, Xiongren... - p. 2015-2024 , 2023
Link: https://doi.org/10.1109/..
 
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11

Genetic Algorithm–Assisted Design of Redistribution Layer V..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Fan, Jiajie ; Qian, Yichen ; Chen, Wei... - p. 260-265 , 2022
Link: https://doi.org/10.1109/..
 
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12

Research on PCT Reliability of Power Devices based on FOPLP:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Jiang, Jing ; Ren, Ya Fei ; Gao, Chen Shan... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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13

Dynamic mechanical analysis of (Ca,Sr)AlSiN3:Eu2+ phosphor/..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Feng, Shuo ; Jiang, Tao ; Chen, Wei... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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14

Solving Virtual Network Mapping Fast by Combining Neural Ne..:

, In: 2021 Ninth International Conference on Advanced Cloud and Big Data (CBD),
Wang, Cong ; Chen, Xiaoyang ; Luo, Yixin. - p. 19-24 , 2022
Link: https://doi.org/10.1109/..
 
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15

Review of Laser Sintering of Nanosilver Pastes for Die Atta..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Chen, Haixue ; Zhang, Jing ; Zhang, Guoqi. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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