Search for persons
X
?
Proceedings of the Seventeenth European Conference on Computer Systems ,
1
Verified programs can party : optimizing kernel extensio..:
, In:
?
Abstracts of the 2020 SIGMETRICS/Performance Joint International Conference on Measurement and Modeling of Computer Systems ,
2
Set the Configuration for the Heart of the OS : On the P..:
, In:
?
2007 European Control Conference (ECC) ,
3
Robust control design of a Proton Exchange Membrane fuel-ce..:
, In:
?
Chinese Language Resources; Text, Speech and Language Technology ,
4
Automated Answer Type Recognition for Primary School Studen..:
, In:
?
2022 IEEE Sensors Applications Symposium (SAS) ,
5
Real-time LiDAR module with 64x128-pixel CMOS SPAD array an..:
, In:
?
Human Interface and the Management of Information: Applications in Complex Technological Environments; Lecture Notes in Computer Science ,
6
Recommendation Model for Tourism by Personality Type Using ..:
, In:
?
2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
7
Music Conversion from Synthetic Piano to Chinese Guzheng Us..:
, In:
?
2019 8th International Conference on Innovation, Communication and Engineering (ICICE) ,
8
High Efficiency Optical Coupler Designed for Daylighting Sy..:
, In:
?
Proceedings of the 21st International Conference on Human-Computer Interaction with Mobile Devices and Services ,
9
SeeingHaptics : Visualizations for Communicating Haptic ..:
, In:
?
Proceedings of the 24th ACM Symposium on Virtual Reality Software and Technology ,
10
GravityCup : a liquid-based haptics for simulating dynam..:
, In:
?
2023 IEEE International Conference on Quantum Computing and Engineering (QCE) ,
11
Quantum-Inspired Optimization for Task Scheduling in Softwa..:
, In:
?
2023 4th Information Communication Technologies Conference (ICTC) ,
12
Mass Media Member's Discussion in the Data Science by Advan..:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
13
Electrochemical analysis of initial oxide layers on copper ..:
, In:
?
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
14
Improvement of Power and Signal Integrity through Layer Ass..:
, In:
?
2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ,
15