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Chen, K J
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1

Demonstration of a CMOS-Compatible Superconducting Cryogeni..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chui, King-Jien ; Li, Hongyu ; Ng, Yong Chyn... - p. 617-622 , 2023
Link: https://doi.org/10.1109/..
 
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2

A low-cost three-axis force sensing system to estimate inte..:

, In: 2023 IEEE Colombian Caribbean Conference (C3),
Meneses, H. ; Solano, E. ; Torres, G... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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3

Reliability analysis of phase differential protection for P..:

, In: 12th International Conference on Renewable Power Generation (RPG 2023),
Yang, D. ; Yang, H. ; Chen, K.... - p. None , 2023
Link: https://doi.org/10.1049/..
 
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4

The Plasma Processes of Porous Dielectric Discharge based o..:

, In: 2023 IEEE International Conference on Plasma Science (ICOPS),
Wang, H. ; Hu, Y. ; Rao, L.... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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5

Improving dielectric properties of polypropylene film for m..:

, In: Tianjin University-IET Electrical & Information Engineering Doctoral Forum (TJU IET 2023),
Chen, K. ; Du, B. X. ; Xiao, M. - p. None , 2023
Link: https://doi.org/10.1049/..
 
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6

Magnetic and dynamic analysis of a new type of wall-climbin..:

, In: 1st International Conference on Mechanical System Dynamics (ICMSD 2022),
Chen, K. ; Li, H. ; Feng, Z.. - p. None , 2022
Link: https://doi.org/10.1049/..
 
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7

Virtual instrument system design based on PCI card and LabW..:

, In: CSAA/IET International Conference on Aircraft Utility Systems (AUS 2022),
Liu, Y. ; Su, P. ; Chen, K. - p. None , 2022
Link: https://doi.org/10.1049/..
 
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8

Dielectric Properties of Metal Deactivator/PP Composite Fil..:

, In: 2022 IEEE 4th International Conference on Dielectrics (ICD),
Du, B.X. ; Zhang, J.H. ; Xiao, M.. - p. 725-728 , 2022
Link: https://doi.org/10.1109/..
 
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9

Dynamic Skip Fire (DSF®) to Simultaneously Improve Emission..:

, In: Proceedings; Heavy-Duty-, On- und Off-Highway-Motoren 2020,
Wang, R. ; Chen, K. ; Schiffgens, H-J. - p. 295-308 , 2021
Link: https://doi.org/10.1007/..
 
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10

Improved Moisture Barrier Properties of High Temperature Vu..:

, In: 2020 IEEE 3rd International Conference on Dielectrics (ICD),
Chen, K. ; An, Z. ; Huang, W.... - p. 566-569 , 2020
Link: https://doi.org/10.1109/..
 
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11

Simulation of Compressive Stress–Strain Curve for Additive ..:

, In: The Minerals, Metals & Materials Series; TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings,
Dhinakar, A. ; Chen, J. K. - p. 835-842 , 2020
Link: https://doi.org/10.1007/..
 
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12

List of Contributors:

, In: Imaging in Dermatology,
Aguirre, J. ; Alarcon, I. ; Alavi, A.... - p. xiii-xv , 2016
Link: https://doi.org/10.1016/..
 
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13

List of Contributors:

, In: Handbook on Natural Pigments in Food and Beverages,
Baranski, R. ; Brauch, J.E. ; Buchweitz, M.... - p. xiii-xiv , 2016
Link: https://doi.org/10.1016/..
 
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14

Research of classification methods of EEG signal based on w..:

, In: International Conference on Automatic Control and Artificial Intelligence (ACAI 2012),
Chen, K. ; Liu, Q. ; Ai, Q. S. - p. 1686-1689 , 2012
Link: https://doi.org/10.1049/..
 
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15

Anti-biased RF MEMS varactor topology for 20–25 dB linearit..:

, In: 2010 IEEE MTT-S International Microwave Symposium,
Chen, K. ; Kovacs, A. ; Peroulis, D. - p. 1-1 , 2010
Link: https://doi.org/10.1109/..
 
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