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Chen, Kuan-chen
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1

Relational Structure Visualization in Composition:

, In: 2023 27th International Conference Information Visualisation (IV),
Chen, Kuan-Chen ; Hsu, Chung-Chian ; Chang, Teng-Wen.. - p. 23-28 , 2023
Link: https://doi.org/10.1109/..
 
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2

Visualization of the Relationship between Void and Eye Move..:

, In: 2022 26th International Conference Information Visualisation (IV),
Chen, Kuan-Chen ; Lee, Chang-Franw ; Chang, Teng-Wen - p. 199-203 , 2022
Link: https://doi.org/10.1109/..
 
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3

Determination of a Methodology for the Fatigue Strength Eva..:

, In: Lecture Notes in Civil Engineering; Practical Design of Ships and Other Floating Structures,
Lee, Chi-Fang ; Quéméner, Yann ; Liao, Po-Kai.. - p. 473-491 , 2020
Link: https://doi.org/10.1007/..
 
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4

Strategic Pairwise Selection for Labeling High-Risk Action ..:

, In: Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence,
Chen, Kuan-Ting ; Chen, Bo-Heng ; Chuang, Kun-Ta - p. 46-60 , 2024
Link: https://doi.org/10.1007/..
 
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5

Semantic Understanding of Traffic Scenes with Large Vision ..:

, In: 2024 IEEE Intelligent Vehicles Symposium (IV),
Jain, Sandesh ; Thapa, Surendrabikram ; Chen, Kuan-Ting.. - p. 1580-1587 , 2024
Link: https://doi.org/10.1109/..
 
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6

Language-Based Deployment Optimization for Random Forests (..:

, In: Proceedings of the 25th ACM SIGPLAN/SIGBED International Conference on Languages, Compilers, and Tools for Embedded Systems,
Malcher, Jannik ; Biebert, Daniel ; Chen, Kuan-Hsun... - p. 58-61 , 2024
Link: https://dl.acm.org/doi/1..
 
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7

Bidirectional Interleaved Two-Stage Converter for DC Microg..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Hua, Chih-Chiang ; Chen, Kuan-Wei - p. 160-162 , 2024
Link: https://doi.org/10.1109/..
 
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8

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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9

A New Ultra-Low Voltage Metal Fuse for High Density OTP App..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Li-Yu ; Chen, Kuan-Ju ; Yuh, Perng-Fei... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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10

Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Shih, Bo-Jheng ; Pan, Yu-Ming ; Wang, Chiao-Yen... - p. 2167-2171 , 2024
Link: https://doi.org/10.1109/..
 
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11

Comparison of Different Copper Nitride Passivation Layers F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Chiao-Yen ; Hung, Tzu-Heng ; Liu, Ping-Jung. - p. 2157-2162 , 2024
Link: https://doi.org/10.1109/..
 
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12

Bekämpfung von Desinformation aus der Perspektive der wehrh..:

, In: Demokratie und Globalisierung,
Chen, Kuan-Wei - p. 119-143 , 2024
Link: https://doi.org/10.1007/..
 
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13

Glass Panel Process Integrated Low Stress Organic Dielectri..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsiung, Chien-Kang ; Wang, Terry ; Wozny, Sarah.. - p. 1896-1899 , 2024
Link: https://doi.org/10.1109/..
 
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14

Layout Guidelines against Charging Damage from the Well-Sid..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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15

21.4 A -108dBc THD+N, 2.3mW Class-H Headphone Amplifier wit..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Shon-Hang ; Hsiao, Chuan-Hung ; Huang, Yi-Wei... - p. 384-386 , 2024
Link: https://doi.org/10.1109/..
 
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