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Lecture Notes in Computer Science; HCI in Games ,
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Research on the User Experience of Affordance of the Cube G..:
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2022 IEEE 22nd International Conference on Bioinformatics and Bioengineering (BIBE) ,
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Association between Mitral Valve Prolapse and panic disorde..:
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Lecture Notes in Networks and Systems; Advances in Usability, User Experience, Wearable and Assistive Technology ,
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Wayfinding Performance Using Mobile Maps with an Overview a..:
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Lecture Notes in Networks and Systems; Advances in Usability, User Experience, Wearable and Assistive Technology ,
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Effects of Affordance on the Visual Perception of Smart Was..:
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Design, User Experience, and Usability: Design for Contemporary Technological Environments; Lecture Notes in Computer Science ,
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Effects of Visual Cue Design and Gender Differences on Wayf..:
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2021 IEEE International Conference on Consumer Electronics and Computer Engineering (ICCECE) ,
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Research on the Classic Block Interface Design of Mobile Ga..:
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Advances in Intelligent Systems and Computing; Advances in Usability, User Experience, Wearable and Assistive Technology ,
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The Effect of Peephole Interaction Mode and User Experience..:
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Advances in Intelligent Systems and Computing; Advances in Usability, User Experience, Wearable and Assistive Technology ,
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Progress Bar Effects as a Time Clue for the Touch-Sensitive..:
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Human-Computer Interaction. Recognition and Interaction Technologies; Lecture Notes in Computer Science ,
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The Effect of Progress Indicator Speeds on Users' Time Perc..:
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Proceedings of the 9th annual conference on Genetic and evolutionary computation ,
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A genetic algorithm for resident physician scheduling probl..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Simulation of Solder Crack Phenomenon in Molding Process:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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The Phenomenon of Tunnel Structure Mold Flowability Experim..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Simulation of the Filler Stuck Mechanism in Molding Process..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Optimization of Process Parameters for Molding Simulation o..:
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2004 IEEE Region 10 Conference TENCON 2004. ,
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