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Chen, Pin-Chih
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1

Analysis, Simulation and Design of Soft-Switching Mechanism..:

, In: 2019 IEEE 4th International Future Energy Electronics Conference (IFEEC),
Chen, Pin-Chih ; Lin, Wei-Che ; Tsai, Mi-Ching.. - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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2

Development and Assessment of Recommendation System Based o..:

, In: 2022 12th International Congress on Advanced Applied Informatics (IIAI-AAI),
Chang, Chih-Kai ; Chen, Pin-Chen - p. 208-213 , 2022
Link: https://doi.org/10.1109/..
 
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3

Dependence of SiO2 Gate Leakage Current on Annealing Temper..:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,
Jhang, Wun-Ciang ; Chen, Pin-Han ; Hsu, Chih-Chieh - p. 569-570 , 2022
Link: https://doi.org/10.1109/..
 
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4

Domain Adaptation for Learning Generator From Paired Few-Sh..:

, In: ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Teng, Chun-Chih ; Chen, Pin-Yu ; Chiu, Wei-Chen - p. 1750-1754 , 2021
Link: https://doi.org/10.1109/..
 
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5

Monolithic 3D BEOL FinFET switch arrays using location-cont..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Hsieh, Ping-Yi ; Huang, Chien-Chi ; Tai, Ming-Chi... - p. 3.1.1-3.1.4 , 2019
Link: https://doi.org/10.1109/..
 
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6

Transient Thermal Damage Simulation for Novel Location-Cont..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Pin-Jun ; Shen, Chih-Ming ; Yang, Chih-Chao... - p. 104-107 , 2019
Link: https://doi.org/10.1109/..
 
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7

Raman Spectroscopic Urine Crystal Detection and Clinical Si..:

, In: IFMBE Proceedings; Future Trends in Biomedical and Health Informatics and Cybersecurity in Medical Devices,
Wang, Chih-Hao ; Zeng, Jing-Xiang ; Chen, Pin-Chuan. - p. 122-128 , 2019
Link: https://doi.org/10.1007/..
 
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8

Xketch : A Sketch-Based Prototyping Tool to Accelerate M..:

, In: Proceedings of the 2017 ACM Conference Companion Publication on Designing Interactive Systems,
Li, Shu-Hui ; Hsu, Jia-Jyun ; Chang, Chih-Ya.. - p. 301-304 , 2017
Link: https://dl.acm.org/doi/1..
 
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9

Using Artificial Neural Networks and Market Profile Theory ..:

, In: Proceedings of the 4th International Conference on Frontiers of Educational Technologies,
Lin, Chien-Cheng ; Hung, Min-Chih ; Chiang, Hsiu-Sen.. - p. 122-126 , 2018
Link: https://dl.acm.org/doi/1..
 
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10

Service oriented architecture for financial customer relati..:

, In: Proceedings of the second international conference on Distributed event-based systems,
Tsai, Wen-Chih ; Chen, An-Pin - p. 301-304 , 2008
Link: https://dl.acm.org/doi/1..
 
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11

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
Link: https://doi.org/10.1109/..
 
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12

Evaluation of Vapor Pressure Induced Debonding Failure in F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Bo-Shuo ; Chiu, Tz-Cheng ; Yin, Wei-Jie.. - p. 150-156 , 2024
Link: https://doi.org/10.1109/..
 
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13

A Compact mmWave 1x4 Antenna Array Design with Shorted Para..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsieh, Sheng-Chi ; Huang, Hong-Sheng ; Hsiao, Wen-Chun... - p. 743-747 , 2024
Link: https://doi.org/10.1109/..
 
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14

Mold Flow Strategy Improvement for Power Module:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Bing-Yuan ; Lu, Ying-Xu ; Huang, Hung-Hsien.. - p. 167-168 , 2024
Link: https://doi.org/10.23919..
 
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15

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
Link: https://doi.org/10.23919..
 
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