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Chen, Ricky
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1

Probing Documentation Practices: Reflecting on Students' Co..:

, In: Creativity and Cognition,
Chen, Ricky ; Demko, Mychajlo ; Byrne, Daragh. - p. 1-14 , 2021
Link: https://dl.acm.org/doi/1..
 
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2

A Unified Graph Framework for Storage-Compute Coupled Clust..:

, In: Proceedings of the International Workshop on Big Data in Emergent Distributed Environments,
Lin, Lynsey ; Chen, Jamie ; Sun, Ricky.. - p. 1-6 , 2024
Link: https://dl.acm.org/doi/1..
 
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3

Frequency Response Characteristics of High-Power Photonic C..:

, In: 2023 IEEE Photonics Conference (IPC),
Pan, Mingsen ; Gautam, Chhabindra ; Kalapala, Akhil... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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4

Design of Highly Scalable Graph Database Systems without Ex..:

, In: Proceedings of the International Workshop on Big Data in Emergent Distributed Environments,
Sun, Ricky ; Chen, Jamie - p. 1-6 , 2023
Link: https://dl.acm.org/doi/1..
 
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5

PacketLab : tools alpha release and demo:

, In: Proceedings of the 22nd ACM Internet Measurement Conference,
Yan, Tzu-Bin ; Chen, Yuxuan ; Chen, Anthea... - p. 766-767 , 2022
Link: https://dl.acm.org/doi/1..
 
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6

Impact of Cavity Resonance Detuning on Watt-Level PCSELs:

, In: 2022 IEEE Photonics Conference (IPC),
Kalapala, Akhil ; Reilly, Kevin ; Rotter, Thomas... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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7

The Resilience of the Grid from the Risk of Failure Due to ..:

, In: 2022 IEEE PES Innovative Smart Grid Technologies - Asia (ISGT Asia),
Sasmono, S. ; Romdlony, M.Z. ; Akmeliawati, R.... - p. 120-124 , 2022
Link: https://doi.org/10.1109/..
 
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8

Ensemble Learning For Mega Man Level Generation:

, In: The 16th International Conference on the Foundations of Digital Games (FDG) 2021,
Li, Bowei ; Chen, Ruohan ; Xue, Yuqing... - p. 1-9 , 2021
Link: https://dl.acm.org/doi/1..
 
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9

Bicyclist and Pedestrian Safety Improvements on Water Stree..:

, In: 2020 Systems and Information Engineering Design Symposium (SIEDS),
Schenkel, Mark ; Nguyen, Tiffany ; Kutay, Cem... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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10

Contributors:

, In: 3D and 4D Printing of Polymer Nanocomposite Materials,
Agarwala, Shweta ; Ahamed, M. Basheer ; AlMaadeed, Mariam AlAli... - p. xi-xiv , 2020
Link: https://doi.org/10.1016/..
 
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11

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
Link: https://doi.org/10.1109/..
 
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12

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
Link: https://doi.org/10.1109/..
 
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13

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
Link: https://doi.org/10.1109/..
 
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14

A 25W SoC with Dual 2GHz Power Cores and Integrated Memory ..:

, In: 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers,
Chen, Zongjian ; von Kaenel, Vincent ; Kassoff, Jason... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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15

Data-Driven Propulsion Load Profile Prediction for All-Elec..:

, In: 2022 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME),
Chen, Wenjie ; Tai, Kang ; Lau, Michael... - p. 1-9 , 2022
Link: https://doi.org/10.1109/..
 
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