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Chen, Si-Kai
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1

Design of Butterfly Plate Piezoelectric Actuator with Dual ..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Chen, Si-Han ; Liu, Shih-Chi ; Cheng, Hao-Chien... - p. 720-723 , 2023
Link: https://doi.org/10.1109/..
 
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2

An Electronic Medical Record Management System Based on Sma..:

, In: 2019 Twelfth International Conference on Ubi-Media Computing (Ubi-Media),
Yang, Wei-Kai ; Chen, Jie-Si ; Chen, Yeong-Sheng - p. 220-223 , 2019
Link: https://doi.org/10.1109/..
 
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3

Study of the microstructure evolution of RDL-TSV electromig..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Xie, Liangliang ; Chen, Si ; Lu, Xiangjun... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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4

Design and Verification of TDDB Test Structures For TSV:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Li, Kai ; Chen, Si ; Yang, XiaoFeng.. - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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5

Thermal-Electric-Mechanical coupling simulation of Cu Pilla..:

, In: 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO),
Li, Kai ; Fu, Zhiwei ; Chen, Si.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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6

Protocol-Aware Backscatter Communication Using Commodity Ra..:

, In: 2020 IEEE/CIC International Conference on Communications in China (ICCC),
Yuan, Longzhi ; Zhang, Rongrong ; Yang, Kai... - p. 336-341 , 2020
Link: https://doi.org/10.1109/..
 
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7

Charge Evacuation Performance of the Insulating Polymers wi..:

, In: 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP),
Feng, Kai ; Zhang, Jia-Wei ; Qin, Si-Chen... - p. 535-537 , 2022
Link: https://doi.org/10.1109/..
 
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8

Paper memory by all printing technology:

, In: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers,
Lien, Der-Hsien ; Kuo, Zhen-Kai ; Huang, Teng-Han... - p. 1-2 , 2014
Link: https://doi.org/10.1109/..
 
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9

A Clustering-Based Dispersion Analysis Approach for Borehol..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,
Li, Si-yi ; Chen, Wen-hui ; Sun, Xue-kai.. - p. 447-453 , 2024
Link: https://doi.org/10.1007/..
 
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10

An efficient selective encryption scheme for HEVC based on ..:

, In: 2021 IEEE 5th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC),
Zhang, Qiao-jia ; Ye, Qing ; Li, Liang.. - p. 683-690 , 2021
Link: https://doi.org/10.1109/..
 
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11

Study on Spatiotemporal Characteristics of Gaze Gesture Inp..:

, In: Human-Computer Interaction. Recognition and Interaction Technologies; Lecture Notes in Computer Science,
Hou, Wen-jun ; Wu, Si-qi ; Chen, Xiao-lin. - p. 283-302 , 2019
Link: https://doi.org/10.1007/..
 
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12

A Transformer-Based Framework for Tiny Object Detection:

, In: 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Liao, Yi-Kai ; Lin, Gong-Si ; Yeh, Mei-Chen - p. 373-377 , 2023
Link: https://doi.org/10.1109/..
 
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13

Study on Minimum Annual Electricity Bill of a Campus Microg..:

, In: 2023 9th International Conference on Control, Decision and Information Technologies (CoDIT),
Huang, Wei-Tzer ; Lin, Wei-Chen ; Yao, Kai-Chao.. - p. 968-973 , 2023
Link: https://doi.org/10.1109/..
 
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14

Contributors:

, In: Deep Learning for Medical Image Analysis,
Bian, Cheng ; Burt, Alastair D. ; Cao, Xiaohuan... - p. xv-xxii , 2024
Link: https://doi.org/10.1016/..
 
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15

Power Efficient Video Super-Resolution on Mobile NPUs with ..:

, In: Lecture Notes in Computer Science; Computer Vision – ECCV 2022 Workshops,
Ignatov, Andrey ; Timofte, Radu ; Chiang, Cheng-Ming... - p. 130-152 , 2023
Link: https://doi.org/10.1007/..
 
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