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Chen, Yi-Fong
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1

Legal Events Classification in Online Social Community Post:

, In: 2023 IEEE 23rd International Conference on Software Quality, Reliability, and Security Companion (QRS-C),
Liu, Yi-Hung ; Feng, Yin-Neng ; Chen, Sheng-Fong - p. 350-355 , 2023
Link: https://doi.org/10.1109/..
 
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2

Effects of Shielding Materials on EMI Performance for 5G Wi..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Yang, Shen-Yu ; Chang, Wei-Shan ; Wu, Yi-Fong... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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3

IR drop Prediction Based on Machine Learning and Pattern Re..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2024,
Chang, Yong-Fong ; Chen, Yung-Chih ; Cheng, Yu-Chen... - p. 516-519 , 2024
Link: https://dl.acm.org/doi/1..
 
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4

Fault Detection in Series Battery Modules: An Integrated Ap..:

, In: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE),
Yen, Jyuan-Fong ; Luo, Yi-Feng ; Chen, Guan-Jhu. - p. 802-805 , 2024
Link: https://doi.org/10.1109/..
 
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5

Integrated All-GaN Driver for High-voltage DC-DC Power Conv..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Hsia, Chin ; Li, Chung-Yi ; Lu, Deng-Fong. - p. 175-176 , 2023
Link: https://doi.org/10.1109/..
 
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6

Robust Cascaded Boost Converter with See-Saw Stress-Relief ..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Li, Chung-Yi ; Chen, Tzu-Yu ; Lu, Deng-Fong... - p. 179-180 , 2023
Link: https://doi.org/10.1109/..
 
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7

Cascaded Local Implicit Transformer for Arbitrary-Scale Sup..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Chen, Hao-Wei ; Xu, Yu-Syuan ; Hong, Min-Fong... - p. 18257-18267 , 2023
Link: https://doi.org/10.1109/..
 
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8

Orbeez-SLAM: A Real-time Monocular Visual SLAM with ORB Fea..:

, In: 2023 IEEE International Conference on Robotics and Automation (ICRA),
Chung, Chi-Ming ; Tseng, Yang-Che ; Hsu, Ya-Ching... - p. 9400-9406 , 2023
Link: https://doi.org/10.1109/..
 
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9

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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10

A planar High-efficient W-band Substrate-Integrated-Wavegui..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yi-Ting ; Kuo, Hung-Chun ; Wu, Po-I... - p. 93-97 , 2022
Link: https://doi.org/10.1109/..
 
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11

Extraction of Complex Permittivity of Dielectrics on Packag..:

, In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),
Lin, Yi-Ting ; Kuo, Hung-Chun ; Wu, Po-I... - p. 564-569 , 2021
Link: https://doi.org/10.1109/..
 
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12

Ultra High Density Package Design and Electrical Analysis i..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hsieh, Tsun-Lung ; Kuo, Hung-Chun ; Jhong, Ming-Fong.. - p. 457-460 , 2019
Link: https://doi.org/10.1109/..
 
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13

Performance Evaluation of a Mobile Deice System Using Fuzzy..:

, In: 2019 International Conference on Machine Learning and Cybernetics (ICMLC),
Chen, Young-Long ; Wang, Neng-Chung ; Ciou, Jing-Fong... - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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14

The Comparison of Package Design and Electrical Analysis in..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Hsieh, Tsun-Lung ; Chou, Yuan-Hsi ; Pan, Po-Chih... - p. 1855-1860 , 2017
Link: https://doi.org/10.1109/..
 
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15

Mask-RCNN Based People Detection Using A Top-View Fisheye C..:

, In: 2019 International Conference on Technologies and Applications of Artificial Intelligence (TAAI),
Wang, Tsaipei ; Hsieh, Yun-Yi ; Wong, Fong-Wen. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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