Cheng, Po-Wen
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1

Enhancing TVM VTA Simulator Performance Through SIMD Vector..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Huang, Kuo-Ting ; Lin, Tzer-Ying ; Cheng, Po-Wen. - p. 418-420 , 2024
 
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2

Sensor Based Dynamic Hand Gesture Recognition by PairNet:

, In: 2019 International Conference on Internet of Things (iThings) and IEEE Green Computing and Communications (GreenCom) and IEEE Cyber, Physical and Social Computing (CPSCom) and IEEE Smart Data (SmartData),
Jhang, Yun-Jie ; Chu, Yen-Cheng ; Tai, Tsung-Ming... - p. 994-1001 , 2019
 
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4

Network operations processes planning:

, In: Proceedings of the 26th conference on Winter simulation,
Peng, Kang ; Cheng, Po-Wen ; Yue, On-Ching - p. 1451-1454 , 1994
 
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5

Investigation on the wind preview quality for lidar-assiste..:

, In: 2022 American Control Conference (ACC),
Guo, Feng ; Schlipf, David ; Zhang, Zhaoyu. - p. 3544-3549 , 2022
 
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7

Cloud-Based Characteristic Recognition System of Permanent ..:

, In: 2023 International Automatic Control Conference (CACS),
 
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8

Research on Optimization of Dielectric Layer Thickness Stan..:

, In: 2022 25th International Conference on Mechatronics Technology (ICMT),
 
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9

Objects Detection Deep Learning System Based on 2-D Winogra..:

, In: 2021 IEEE 10th Global Conference on Consumer Electronics (GCCE),
Liu, Fang-Yi ; Liao, Che-Lun ; Chou, Po-Wen. - p. 454-455 , 2021
 
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10

Can We Ever Get to a 100 nm Tall Library? Power Rail Design..:

, In: 2020 IEEE Symposium on VLSI Technology,
Moroz, V. ; Lin, X-W. ; Asenov, P.... - p. 1-2 , 2020
 
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11

Board Game Design for Python Programming Education:

, In: 2019 IEEE International Conference on Engineering, Technology and Education (TALE),
 
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12

First demonstration of flexible poly-Si nano-FETs (W/Lg= 50..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Hou, Po-Cheng ; Huang, Wen-Hsien ; Kao, Ming-Hsuan... - p. 179-181 , 2022
 
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13

DC-Link Current Ripple Mitigation of Three-Phase NPC Conver..:

, In: 2022 IEEE Industry Applications Society Annual Meeting (IAS),
 
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15

A numerical study of Si-TMD contact with n/p type operation..:

, In: 2016 IEEE International Electron Devices Meeting (IEDM),
Tang, Ying-Tsan ; Li, Kai-Shin ; Li, Lain-Jong... - p. 14.3.1-14.3.4 , 2016
 
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