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2022 30th Euromicro International Conference on Parallel, Distributed and Network-based Processing (PDP) ,
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ESCA: Effective System Call Aggregation for Event-Driven Se..:
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Lecture Notes in Civil Engineering; Proceedings of the Canadian Society of Civil Engineering Annual Conference 2022 ,
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Stress–Strain Behaviour of Boundary Elements in Reinforced ..:
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2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB) ,
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Comparative Analysis of Real-Time Multi-Person Pose Detecti..:
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2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB) ,
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Using Real-Time Integrated Computer Vision and Deep Learnin..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
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Numerical Study of the Mechanism of Fracture Height Extensi..:
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Ion-Exchange Chromatography and Related Techniques ,
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Continuous ion-exchange chromatography for protein polishin..:
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Proceedings of the 32nd IEEE/ACM International Conference on Program Comprehension ,
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On the comprehensibility of functional decomposition: An em..:
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2024 6th Global Power, Energy and Communication Conference (GPECOM) ,
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Parametric Effects of a Heat Transfer System using Supercri..:
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Proceedings of the 39th ACM/SIGAPP Symposium on Applied Computing ,
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Towards Optimizations of Quantum Circuit Simulation for Sol..:
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Proceedings of the 2024 ACM Designing Interactive Systems Conference ,
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Exploring Augmented Reality Interface Designs for Virtual M..:
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Proceedings of the 43rd ACM Symposium on Principles of Distributed Computing ,
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A Tight Lower Bound for 3-Coloring Grids in the Online-LOCA..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
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Research on the Acid Fracturing Technology of Asphaltic Res..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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30.4 A Fully Integrated Annealing Processor for Large-Scale..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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