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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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4-Point-Bending Characterization of Interfacial Adhesion St..:
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2021 IEEE International Conference on Consumer Electronics and Computer Engineering (ICCECE) ,
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Towards a Semantic-enabled Agent-oriented Distributed Clini..:
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Proceedings of the 2nd World Symposium on Software Engineering ,
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A Semantic-based Multi-agent Dynamic Interaction Model:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Study of Charge Neutralization Techniques to Prevent Copper..:
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2008 4th International Conference on Wireless Communications, Networking and Mobile Computing ,
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Application of PDCA Cycle in the Performance Management Sys..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Case Study of SIMS Analysis on Insulators:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Influence of RF Power on Crystal Formation in Ionized Metal..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Impact of High Temperature Storage for Prolonged Duration o..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Comparison of Mechanical Properties of Nickel-Palladium Pla..:
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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Case Study of SIMS analysis on Germanium isotopes and Arsen..:
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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
13
Multi-layered film stack models to simulate X-ray reflectiv..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
14
Case Study on Precise Boron Quantification of Mixed Matrix:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
15