Cheung, Siu Hong
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1

Development of an IoT-based Fish Farm Monitoring System:

, In: 2023 IEEE 13th International Conference on Control System, Computing and Engineering (ICCSCE),
 
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2

Implementation of Artificial Intelligence Chatbot in Semico..:

, In: 2023 IEEE 13th International Conference on Control System, Computing and Engineering (ICCSCE),
 
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3

VLSI Design Course with Verification of RISC-V Design using..:

, In: 2022 IEEE 12th International Conference on Control System, Computing and Engineering (ICCSCE),
 
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4

Trophic Relationship of Sympatric Juvenile Asian Horseshoe ..:

, In: International Horseshoe Crab Conservation and Research Efforts: 2007- 2020,
Hu, Menghong ; Kwan, Kit Yue ; Xie, Zhe... - p. 633-649 , 2022
 
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5

Implementation of the Force Measurement Feature in the Educ..:

, In: 2019 9th IEEE International Conference on Control System, Computing and Engineering (ICCSCE),
Loh, Siu Hong ; Yeap, Kim Ho ; Lim, Jun Yan. - p. 6-10 , 2019
 
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6

Surface Energy Characterization for Die-Level Cu Hybrid Bon..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Belyansky, Michael... - p. 312-316 , 2022
 
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7

Comparing the Estimations of Value-at-Risk Using Artificial..:

, In: Proceedings of the International Neural Networks Society; Recent Advances in Big Data and Deep Learning,
Cheung, Siu ; Chen, Ziqi ; Li, Yanli - p. 267-275 , 2019
 
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9

Mathematical Retrieval Techniques for Online Mathematics Le..:

, In: Handbook of Research on Methods and Techniques for Studying Virtual Communities,
 
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12

Voids-free Die-level Cu/ILD Hybrid bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Polomoff, Nicholas... - p. 800-805 , 2023
 
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13

Nurturing Artificial Intelligence Literacy in Students with..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
 
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14

Predictive Food Safety Risk Monitoring:

, In: 2023 10th International Conference on ICT for Smart Society (ICISS),
 
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15

Direct Die to Wafer Cu Hybrid Bonding for Volume Production:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Fan, Chun Ho ; Ng, Hoi Ping ; So, Siu Cheung... - p. 91-96 , 2023
 
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