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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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300mm Full Thickness Si-Based IC Singulation Using Plasma D..:
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Principles of Developmental Genetics ,
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Applications of Deep Sequencing to Developmental Systems:
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Reference Module in Earth Systems and Environmental Sciences ,
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Remote Sensing from Satellites☆:
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Proceedings of the 10th international conference on Software engineering ,
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High level specification of concurrency control in distribu..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Evaluation of Vapor Pressure Induced Debonding Failure in F..:
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Cross-Cultural Design; Lecture Notes in Computer Science ,
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Redefining Truth in the Context of AI-Truth Era: A Practice..:
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2024 16th International Conference on Computer and Automation Engineering (ICCAE) ,
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Dual-Attention Mechanism for Monocular Depth Estimation:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:
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2024 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV) ,
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Masking Improves Contrastive Self-Supervised Learning for C..:
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AI Technologies and Virtual Reality; Smart Innovation, Systems and Technologies ,
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A Study on the Integration of Bim and Mixed Reality in Stee..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Next Generation Large Size High Interconnect Density CoWoS-..:
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Proceedings of the 55th ACM Technical Symposium on Computer Science Education V. 1 ,
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Effect of Deadlines on Student Submission Timelines and Suc..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
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