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Chiu, A
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1

300mm Full Thickness Si-Based IC Singulation Using Plasma D..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Surapaneni, R. ; Hamlin, B. S. ; Chiu, J.... - p. 1019-1024 , 2022
Link: https://doi.org/10.1109/..
 
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2

Applications of Deep Sequencing to Developmental Systems:

, In: Principles of Developmental Genetics,
Ira, L. ; Blitz ; Luong, Mui... - p. 37-48 , 2015
Link: https://doi.org/10.1016/..
 
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3

Remote Sensing from Satellites☆:

, In: Reference Module in Earth Systems and Environmental Sciences,
Acker, J. ; Williams, R. ; Chiu, L.... , 2014
Link: https://doi.org/10.1016/..
 
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4

Current Clinical Status of Cytoprotection:

, In: Primer on Cerebrovascular Diseases,
CHIU, D ; GROTTA, J - p. 731-737 , 1997
Link: https://doi.org/10.1016/..
 
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5

High level specification of concurrency control in distribu..:

, In: Proceedings of the 10th international conference on Software engineering,
Chiu, L. ; Liu, M. T. - p. 309-317 , 1988
Link: https://dl.acm.org/doi/1..
 
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6

Evaluation of Vapor Pressure Induced Debonding Failure in F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Bo-Shuo ; Chiu, Tz-Cheng ; Yin, Wei-Jie.. - p. 150-156 , 2024
Link: https://doi.org/10.1109/..
 
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7

Redefining Truth in the Context of AI-Truth Era: A Practice..:

, In: Cross-Cultural Design; Lecture Notes in Computer Science,
Li, Yanlin ; Chiu, Chih-Yung - p. 245-257 , 2024
Link: https://doi.org/10.1007/..
 
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8

Dual-Attention Mechanism for Monocular Depth Estimation:

, In: 2024 16th International Conference on Computer and Automation Engineering (ICCAE),
Chiu, Chui-Hong ; Astuti, Lia ; Lin, Yu-Chen. - p. 456-460 , 2024
Link: https://doi.org/10.1109/..
 
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9

Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Li, Chen-Ning ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 109-110 , 2024
Link: https://doi.org/10.23919..
 
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10

Masking Improves Contrastive Self-Supervised Learning for C..:

, In: 2024 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV),
Chin, Zhi-Yi ; Jiang, Chieh-Ming ; Huang, Ching-Chun.. - p. 2749-2758 , 2024
Link: https://doi.org/10.1109/..
 
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11

A Study on the Integration of Bim and Mixed Reality in Stee..:

, In: AI Technologies and Virtual Reality; Smart Innovation, Systems and Technologies,
Chen, Yi-Jao ; Chiu, Hong-Lin ; Ger, Tzu-Hsiang - p. 357-367 , 2024
Link: https://doi.org/10.1007/..
 
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12

Next Generation Large Size High Interconnect Density CoWoS-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Chien-Hsun ; Hu, YH ; Chen, SM... - p. 259-263 , 2024
Link: https://doi.org/10.1109/..
 
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13

Effect of Deadlines on Student Submission Timelines and Suc..:

, In: Proceedings of the 55th ACM Technical Symposium on Computer Science Education V. 1,
Chiu, Meng-Chieh ; Moss, Eliot ; Richards, Timothy - p. 207-213 , 2024
Link: https://dl.acm.org/doi/1..
 
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14

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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15

Low DRAM Memory Access and Flexible Dataflow Convolutional ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Chen, Yi-Fan ; Chang, Yu-Jen ; Chiu, Ching-Te... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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