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Chiu, Fei-Hsing
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1

18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format..:

, In: 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers,
Ju, Chi-Cheng ; Liu, Tsu-Ming ; Lee, Kun-Bin... - p. 1-3 , 2015
Link: https://doi.org/10.1109/..
 
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2

Metapunch X: Combing Multidisplay and Exertion Interaction ..:

, In: ACM SIGGRAPH 2024 Immersive Pavilion,
Chang, Kuan-Ning ; Lin, Chia-Hui ; Weng, Yu-Hsiang... - p. 1-2 , 2024
Link: https://dl.acm.org/doi/1..
 
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3

A W-Band Phase-Shifter-Embedded PA in 40-nm CMOS for 6G App..:

, In: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023,
Wang, Chun ; Chiu, Pin-Chun ; Li, Chun-Hsing - p. 1140-1143 , 2023
Link: https://doi.org/10.1109/..
 
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4

Multimodal Framework for Fake Messages Detection with Textu..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Lin, Chu-Hsing ; Jian, Jhen-Yu ; Wu, Yu-Fei.. - p. 487-491 , 2023
Link: https://doi.org/10.1109/..
 
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5

Application of Oleic acid functionalized Fe3O4 magnetic nan..:

, In: 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers),
Hermosa, Glemarie C. ; Fang, Li-Hsing ; Liao, Chien-Shiun... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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6

Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Yang, Shih-Chi ; Ong., Jia-Juen ; Tran, Dinh-Phuc... - p. 13-14 , 2023
Link: https://doi.org/10.23919..
 
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7

A Compact and Low-Cost THz SoP Heterogeneous Integration Pl..:

, In: 2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT),
Li, Chun-Hsing ; Chiu, Te-Yen - p. 128-130 , 2022
Link: https://doi.org/10.1109/..
 
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8

Appling Artificial Intelligence Techniques on Singing Teach..:

, In: Proceedings of the 28th ACM Symposium on Virtual Reality Software and Technology,
Lin, Shih-Chieh ; Chou, Chien-Hsing ; Ke, Ming-Feng... - p. 1-2 , 2022
Link: https://dl.acm.org/doi/1..
 
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9

A Cloud Native Management and Orchestration Framework for 5..:

, In: 2022 IEEE International Conference on Service-Oriented System Engineering (SOSE),
Chiu, Yi-Sung ; Yen, Li-Hsing ; Wang, Tse-Han. - p. 69-76 , 2022
Link: https://doi.org/10.1109/..
 
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10

Applying Image Processing Technology to Estimate Vehicle Sp..:

, In: Advances in Intelligent Information Hiding and Multimedia Signal Processing; Smart Innovation, Systems and Technologies,
Chiu, Ming-Sung ; Liang, Tung-Ming ; Lo, Yung-Cheng... - p. 333-340 , 2022
Link: https://doi.org/10.1007/..
 
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11

Innovative Remote Sensing System Measuring Microclimate of ..:

, In: 2020 IEEE Eurasia Conference on IOT, Communication and Engineering (ECICE),
Chen, Chia-Hsing ; Wu, Ko-Chiu - p. 136-139 , 2020
Link: https://doi.org/10.1109/..
 
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12

A Low-Loss Balun-Embedded Interconnect for THz Heterogeneou..:

, In: 2020 IEEE/MTT-S International Microwave Symposium (IMS),
Chiu, Te-Yen ; Lee, Yu-Ling ; Ko, Chun-Lin.. - p. 1043-1046 , 2020
Link: https://doi.org/10.1109/..
 
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13

Failure Mechanism of the Power-Clamp Device of Buck Convert..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Lee, Jian-Hsing ; Liu, Wu-Yang ; Hung, Chung-Yu... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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14

A 55nm 1-to-8 bit Configurable 6T SRAM based Computing-in-M..:

, In: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC),
Zhang, Zhixiao ; Chen, Jia-Jing ; Si, Xin... - p. 217-218 , 2019
Link: https://doi.org/10.1109/..
 
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15

Deploying a Top-100 Supercomputer for Large Parallel Worklo..:

, In: Practice and Experience in Advanced Research Computing 2019: Rise of the Machines (learning),
Ponce, Marcelo ; van Zon, Ramses ; Northrup, Scott... - p. 1-8 , 2019
Link: https://dl.acm.org/doi/1..
 
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