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Cho, Chih-Yi
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1

First BEOL-compatible, 10 ns-fast, and Durable 55 nm Top-pS..:

, In: 2023 International Electron Devices Meeting (IEDM),
Li, Kai-Shin ; Shieh, Jia-Min ; Chen, Yi-Ju... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Improving datapath utilization of programmable DSP with com..:

, In: 2008 IEEE International Symposium on Circuits and Systems (ISCAS),
Shih-Hao Ou ; Yi Cho ; Tay-Jyi Lin. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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3

Structural Topology Optimization Using Genetic Algorithm an..:

, In: Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence,
Hsu, Chih-Yi ; Chen, Yi-Ruei ; Ting, Chuan-Kang - p. 195-208 , 2024
Link: https://doi.org/10.1007/..
 
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4

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
Link: https://doi.org/10.1109/..
 
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5

PDTW150K: A Dataset for Patent Drawing Retrieval:

, In: MultiMedia Modeling; Lecture Notes in Computer Science,
Hsu, Chan-Ming ; Lin, Tse-Hung ; Chen, Yu-Hsien. - p. 57-67 , 2024
Link: https://doi.org/10.1007/..
 
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6

Semiconductor Package Design Flow and Platform Applied on F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Youle ; Chang, Keng-Tuan ; Kuo, Hung-Chun.. - p. 21-22 , 2023
Link: https://doi.org/10.23919..
 
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7

Comparison of Drain Current Transient Characteristics of Al..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
Cho, Chih-Wei ; Hsin, Yue-Ming - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Robotic Slag Removal System with Position Compensation and ..:

, In: 2023 International Conference on Advanced Robotics and Intelligent Systems (ARIS),
Shih, Chih-Hsuan ; Wu, Chih-Yi - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

Diagnosis of Medullary (C Cell) Thyroid Carcinoma:

, In: Thyroid FNA Cytology,
Liu, Chih-Yi ; Chen, Chien-Chin - p. 475-485 , 2023
Link: https://doi.org/10.1007/..
 
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10

A 4.63pJ/b 112Gb/s DSP-Based PAM-4 Transceiver for a Large-..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Park, Henry ; Abdullatif, Mohammed ; Chen, Ehung... - p. 5-7 , 2023
Link: https://doi.org/10.1109/..
 
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11

Stage II Colon Cancer: Towards an Individualized Treatment ..:

, In: Difficult Decisions in Colorectal Surgery; Difficult Decisions in Surgery: An Evidence-Based Approach,
Dosunmu, Gideon ; Liao, Chih-Yi - p. 201-210 , 2023
Link: https://doi.org/10.1007/..
 
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12

Investigation on ESD Robustness of 1200-V D- Mode GaN MIS-H..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Ke, Chao-Yang ; Wang, Wei-Cheng ; Ker, Ming-Dou.. - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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13

Pineapple Quality Classification in a Multimodal Audio-Visu..:

, In: 2023 IEEE International Conference on Big Data (BigData),
Jiang, Yi-Lu ; Chang, Wen-Chang ; Chiu, Chih-Yi - p. 6175-6177 , 2023
Link: https://doi.org/10.1109/..
 
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14

D-Mode GaN HEMT with Direct Drive:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
Heumesser, Vanessa ; Lai, Jih-Sheng ; Hsieh, Hsin-Che... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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15

Deep Learning based Refinement for Package Substrate Routin:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Peng-Tai ; Koyama, Tsubasa ; Chang, Keng-Tuan... - p. 1871-1874 , 2023
Link: https://doi.org/10.1109/..
 
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