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Choi, Kwang-Seong
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1

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
Link: https://doi.org/10.1109/..
 
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2

Reliability of Indium Solder Joints using a Laser-Assisted ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Jung, Ji Eun ; Eom, Yong-Sung ; Joo, Jiho... - p. 2237-2243 , 2024
Link: https://doi.org/10.1109/..
 
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3

Micro-structure analysis of solder joint using room tempera..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Moon, Yoon Hwan ; Joo, Jiho ; Choi, Gwang-Mun... - p. 01-06 , 2023
Link: https://doi.org/10.1109/..
 
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4

Anisotropic Solder Paste (ASP) Material Solution for Laser ..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Jang, Ki-Seok ; Eom, Yong-Sung ; Choi, Gwang-Mun... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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5

Laser-Assisted Bonding with Compression (LABC) based Tiling..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1385-1389 , 2023
Link: https://doi.org/10.1109/..
 
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6

Process Window of Mini-LED Display Panel Packaging using La..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Eom, Yong-Sung ; Choi, Gwang-Mun ; Jang, Ki-Seok... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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7

Interconnection Reliability of Mini LEDs for Display Applic..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kye, In-Seok ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1184-1191 , 2022
Link: https://doi.org/10.1109/..
 
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8

Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 198-203 , 2022
Link: https://doi.org/10.1109/..
 
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9

Epoxy based Solder Paste for Flexible Substrate with Laser ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Jang, Ki-Seok ; Eom, Yong-Sung ; Choi, Gwang-Mun... - p. 28-30 , 2022
Link: https://doi.org/10.1109/..
 
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10

Mini LED array transferred onto a flexible substrate using ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Joo, Jiho ; Choi, Gwang-Mun ; Lee, Chanmi... - p. 619-624 , 2022
Link: https://doi.org/10.1109/..
 
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11

Development of Digital Signage Modules composed of Mini-LED..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Jang, Ki-seok... - p. 1031-1036 , 2020
Link: https://doi.org/10.1109/..
 
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12

Development of bonding process for flexible devices with fi..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Joo, Jiho ; Eom, Yong-Sung ; Jang, Ki-seok.. - p. 1309-1314 , 2020
Link: https://doi.org/10.1109/..
 
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13

Advanced Interconnection technology with Laser Assisted Bon..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
EOM, Yong-Sung ; JANG, Ki-Seok ; JOO, Jiho. - p. 1-5 , 2019
Link: https://doi.org/10.23919..
 
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14

Development of Laser-Assisted Bonding with Compression (LAB..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Choi, Kwang-Seong ; Eom, Yong-Sung ; Moon, Seok Hwan... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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15

Silica filler content in NCP and its effects on the reliabi..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Alves Braganca, Wagno ; Eom, Yong-Sung ; Son, Jihye... - p. 1-8 , 2017
Link: https://doi.org/10.1109/..
 
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